Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-24_W7.62mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 24
- THT
- 10.5×31.0
- Boards
- 16
SMDIP-6_W7.62mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 6
- SMD
- 10.1×8.1
- Boards
- 16
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 15
UQFN-10_1.4x1.8mm_P0.4mm
Package_DFN_QFN
UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)
- Pads
- 10
- SMD
- 2.6×3.0
- Boards
- 15
DIP-4_W8.89mm_SMDSocket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 4
- SMD
- 12.5×5.7
- Boards
- 15
TO-277A
Package_TO_SOT_SMD
Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf
- Pads
- 3
- SMD
- 5.3×7.3
- Boards
- 15
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14
DIP-18_W7.62mm_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 18
- THT
- 10.5×23.4
- Boards
- 14
DIP-8_W7.62mm_SMDSocket_SmallPads
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 8
- SMD
- 10.7×10.8
- Boards
- 14
SMDIP-16_W9.53mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 16
- SMD
- 12.0×20.8
- Boards
- 14
TO-92L
Package_TO_SOT_THT
TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)
- Pads
- 3
- THT
- 5.5×4.6
- Boards
- 14
DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm
Package_DFN_QFN
DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)
- Pads
- 9
- SMD
- 3.3×3.5
- Boards
- 13
QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
Package_DFN_QFN
QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)
- Pads
- 25
- SMD
- 4.3×4.3
- Boards
- 13
QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295)
- Pads
- 41
- SMD
- 7.2×7.2
- Boards
- 13
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 13
SMDIP-4_W7.62mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 4
- SMD
- 10.1×5.6
- Boards
- 13
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
SSO-8_6.8x5.9mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 13.1×6.4
- Boards
- 13
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 12