Footprints
354 footprints matching “pads”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Fuse_0402_1005Metric_Pad0.77x0.64mm_HandSolder
Fuse
Fuse SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 2.2×0.9
- Boards
- 5
L_2512_6332Metric_Pad1.52x3.35mm_HandSolder
Inductor_SMD
Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 5
RaspberryPi_Pico_SMD
Module
Raspberry Pi Pico (non-W) surface-mount footprint for reflow soldering with test points and debug pads, supports Raspberry Pi Pico 2 (non-W), https://datasheets.raspberrypi.com/pico/pico-datasheet.pdf
- Pads
- 49
- SMD
- 23.1×53.9
- Boards
- 5
DIP-14_W7.62mm_SMDSocket_SmallPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 14
- SMD
- 10.7×18.4
- Boards
- 5
DIP-16_W8.89mm_SMDSocket_LongPads
Package_DIP
16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 16
- SMD
- 12.5×20.9
- Boards
- 5
TerminalBlock_Phoenix_PT-1,5-12-5.0-H_1x12_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-12-5.0-H, 12 pins, pitch 5mm, size 60x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf
- Pads
- 12
- THT
- 61.0×10.0
- Boards
- 5
C_1808_4520Metric_Pad1.72x2.30mm_HandSolder
Capacitor_SMD
Capacitor SMD 1808 (4520 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: datasheet page 3, https://product.tdk.com/system/files/dam/doc/product/capacitor/ceramic/mlcc/catalog/mlcc_commercial_soft_en.pdf)
- Pads
- 2
- SMD
- 6.6×2.8
- Boards
- 4
RaspberryPi_Pico_SMD_HandSolder
Module
Raspberry Pi Pico (non-W) surface-mount footprint with debug pads for hand soldering, supports Raspberry Pi Pico 2 (non-W), https://datasheets.raspberrypi.com/pico/pico-datasheet.pdf
- Pads
- 43
- SMD
- 23.1×53.9
- Boards
- 4
Oscillator_DIP-8_LargePads
Oscillator
Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf
- Pads
- 4
- THT
- 13.2×13.2
- Boards
- 4
DIP-10_W7.62mm_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 10
- THT
- 10.5×13.2
- Boards
- 4
DIP-48_W15.24mm_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 48
- THT
- 18.1×61.5
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
TO-92_Inline_Horizontal1
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 4
R_0815_2038Metric_Pad1.20x4.05mm_HandSolder
Resistor_SMD
Resistor SMD 0815 (2038 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.susumu.co.jp/common/pdf/n_catalog_partition07_en.pdf)
- Pads
- 2
- SMD
- 3.8×4.6
- Boards
- 4
R_1020_2550Metric_Pad1.33x5.20mm_HandSolder
Resistor_SMD
Resistor SMD 1020 (2550 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf)
- Pads
- 2
- SMD
- 4.3×5.7
- Boards
- 4
R_4020_10251Metric_Pad1.65x5.30mm_HandSolder
Resistor_SMD
Resistor SMD 4020 (10251 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf)
- Pads
- 2
- SMD
- 12.0×5.8
- Boards
- 4
TerminalBlock_Phoenix_MKDS-1,5-7-5.08_1x07_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-7-5.08, 7 pins, pitch 5.08mm, size 35.6x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 7
- THT
- 36.6×10.8
- Boards
- 4
L_2010_5025Metric_Pad1.52x2.65mm_HandSolder
Inductor_SMD
Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 6.7×3.2
- Boards
- 3
Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 2.9×3.9
- Boards
- 3
DIP-12_W7.62mm_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 12
- THT
- 10.5×15.7
- Boards
- 3
DIP-4_W10.16mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 4
- THT
- 13.1×5.6
- Boards
- 3
DIP-4_W7.62mm_Socket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 4
- THT
- 10.7×5.7
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3