Footprints

198 footprints matching “sop”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

198 footprints · page 6 of 9

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TSSOP-24

FP3D

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Pads: 24
SMD: 7.6×8.4
Boards: —

TSSOP-24-EP

FP3D

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Pads: 25
SMD: 7.6×8.4
Boards: —

TSSOP-28

FP3D

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Pads: 28
SMD: 7.6×10.2
Boards: —

TSSOP-8

FP3D

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Pads: 8
SMD: 7.6×3.6
Boards: —

Analog_MSOP-12-16_3x4.039mm_P0.5mm

FP3D

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)

Pads: 12
SMD: 5.6×4.5
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp

FP3D

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 36
SMD: 15.9×16.4
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads: 39
SMD: 9.5×13.0
Boards: —

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads: 39
SMD: 9.5×13.0
Boards: —

JEITA_SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)

Pads: 16
SMD: 7.7×10.4
Boards: —

MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads: 13
SMD: 6.3×4.5
Boards: —

MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)

Pads: 9
SMD: 6.3×3.5
Boards: —

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads: 12
SMD: 13.6×11.2
Boards: —

PSOP-44_16.9x27.17mm_P1.27mm

FP3D

Package_SO

PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm

Pads: 44
SMD: 19.2×28.8
Boards: —

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —