Footprints

1,589 footprints matching “P1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,589 footprints · page 65 of 67

Matched by name and keywords. Search by meaning instead

DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm

FP3D

Package_DFN_QFN

DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf)

Pads
17
SMD
4.0×5.6
Boards
—

DFN-18-1EP_3x5mm_P0.5mm_EP1.66x4.4mm

FP3D

Package_DFN_QFN

DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf)

Pads
19
SMD
4.0×5.6
Boards
—

DFN-8-1EP_3x2mm_P0.45mm_EP1.66x1.36mm

FP3D

Package_DFN_QFN

DCB Package 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf)

Pads
9
SMD
4.0×2.6
Boards
—

DFN-8-1EP_3x3mm_P0.65mm_EP1.5x2.25mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.diodes.com/assets/Package-Files/U-DFN3030-8-Type-E.pdf)

Pads
9
SMD
4.2×3.5
Boards
—

HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm

FP3D

Package_DFN_QFN

HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)

Pads
17
SMD
4.3×4.3
Boards
—

HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm_ThermalVias

FP3D

Package_DFN_QFN

HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)

Pads
17
SMD
4.3×4.3
Boards
—

Maxim_WSON-8-1EP_3x2mm_P0.5mm_EP1.75x1.63mm

FP3D

Package_DFN_QFN

Maxim WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0174.pdf, https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn-ep/90-0091.pdf)

Pads
9
SMD
4.1×2.5
Boards
—

OnSemi_SIP-38-6EP-9x7mm_P0.65mm_EP1.2x1.2mm

FP3D

Package_DFN_QFN

On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19)

Pads
44
SMD
9.5×7.5
Boards
—

QFN-12-1EP_3x3mm_P0.5mm_EP1.65x1.65mm

FP3D

Package_DFN_QFN

QFN, 12 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_12_%2005-08-1855.pdf)

Pads
13
SMD
4.3×4.3
Boards
—

QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)

Pads
25
SMD
4.3×4.3
Boards
—

QFN-28-1EP_3x6mm_P0.5mm_EP1.7x4.75mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081926_0_UDE28.pdf)

Pads
29
SMD
4.3×7.3
Boards
—

TDFN-6-1EP_2.5x2.5mm_P0.65mm_EP1.3x2mm

FP3D

Package_DFN_QFN

TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf)

Pads
7
SMD
3.8×3.0
Boards
—

TDFN-6-1EP_2.5x2.5mm_P0.65mm_EP1.3x2mm_ThermalVias

FP3D

Package_DFN_QFN

TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf)

Pads
7
SMD
3.8×3.0
Boards
—

Texas_RRW0024A_WQFN-24-1EP_3x3mm_P0.4mm_EP1.9x1.9mm

FP3D

Package_DFN_QFN

Texas RRW0024A WQFN, 24 Pin (Texas RRW0024A, https://www.ti.com/lit/ml/mpqf657a/mpqf657a.pdf, https://www.ti.com/lit/ds/symlink/drv8311.pdf#page=91)

Pads
25
SMD
3.9×3.9
Boards
—

Texas_RRW0024A_WQFN-24-1EP_3x3mm_P0.4mm_EP1.9x1.9mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RRW0024A WQFN, 24 Pin (Texas RRW0024A, https://www.ti.com/lit/ml/mpqf657a/mpqf657a.pdf, https://www.ti.com/lit/ds/symlink/drv8311.pdf#page=91)

Pads
25
SMD
3.9×3.9
Boards
—

Texas_RVC0020A_WQFN-20-1EP_3x4mm_P0.5mm_EP1.6x2.6mm

FP3D

Package_DFN_QFN

Texas RVC0020A WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps25810.pdf#page=35)

Pads
21
SMD
3.9×4.9
Boards
—

Texas_RVC0020A_WQFN-20-1EP_3x4mm_P0.5mm_EP1.6x2.6mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RVC0020A WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps25810.pdf#page=35)

Pads
21
SMD
3.9×4.9
Boards
—

UQFN-12-1EP_2x2mm_P0.4mm_EP1.1x1.1mm

FP3D

Package_DFN_QFN

UQFN, 12 Pin (https://www.wch-ic.com/download/file?id=396, https://www.wch-ic.com/downloads/CH32V006DS0_PDF.html, https://www.wch-ic.com/downloads/PACKAGE_PDF.html)

Pads
13
SMD
3.3×3.3
Boards
—

JEITA_SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)

Pads
16
SMD
7.7×10.4
Boards
—

MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads
13
SMD
6.3×4.5
Boards
—

MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)

Pads
9
SMD
6.3×3.5
Boards
—

PSOP-44_16.9x27.17mm_P1.27mm

FP3D

Package_SO

PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm

Pads
44
SMD
19.2×28.8
Boards
—

SOIC-14-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)

Pads
14
SMD
7.4×10.4
Boards
—

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads
5
SMD
8.4×4.1
Boards
—