Footprints
324 footprints matching “0.5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PQFP-208_28x28mm_P0.5mm
Package_QFP
PQFP, 208 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 208
- SMD
- 31.9×31.9
- Boards
- 2
PQFP-240_32.1x32.1mm_P0.5mm
Package_QFP
PQFP, 240 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 240
- SMD
- 35.9×35.9
- Boards
- 2
TQFP-100-1EP_14x14mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
TQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- 2
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 2
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 2
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
TSSOP-20_4.4x5mm_P0.5mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×5.5
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
TSSOP-56_6.1x14mm_P0.5mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 9.4×14.5
- Boards
- 2
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
CP_Radial_Tantal_D10.5mm_P2.50mm
Capacitor_THT
CP, Radial_Tantal series, Radial, pin pitch=2.50mm, diameter=10.5mm, height=10mm, Tantal Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf
- Pads
- 2
- THT
- 11.0×11.0
- Boards
- 1
L_Radial_D24.4mm_P23.10mm_Murata_1400series
Inductor_THT
Inductor, Radial series, Radial, pin pitch=23.10mm, diameter=24.4mm, height=10.5mm, Murata, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf
- Pads
- 2
- THT
- 25.6×24.9
- Boards
- 1
BGA-100_11.0x11.0mm_Layout10x10_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-100, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00223-02.pdf
- Pads
- 100
- SMD
- 13.0×13.0
- Boards
- 1
BGA-9_1.6x1.6mm_Layout3x3_P0.5mm
Package_BGA
BGA-9, http://www.ti.com/lit/ds/symlink/bq27421-g1.pdf
- Pads
- 9
- SMD
- 3.6×3.6
- Boards
- 1
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-24-1EP_4x4mm_P0.5mm_EP2.3x2.3mm_ThermalVias
Package_CSP
LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-24/cp_24_14.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 1
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm_ThermalVias
Package_CSP
LFCSP, 32 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADV7280.PDF#page=28)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 1
DFN-10-1EP_2x3mm_P0.5mm_EP0.64x2.4mm
Package_DFN_QFN
DDB Package; 10-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf)
- Pads
- 11
- SMD
- 3.1×3.6
- Boards
- 1
DFN-12-1EP_4x4mm_P0.5mm_EP2.66x3.38mm
Package_DFN_QFN
DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf)
- Pads
- 13
- SMD
- 5.0×4.6
- Boards
- 1
DFN-14-1EP_3x4mm_P0.5mm_EP1.7x3.3mm
Package_DFN_QFN
DE Package; 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf)
- Pads
- 15
- SMD
- 4.1×4.6
- Boards
- 1