171 footprints matching “thermal”

Package_DFN_QFN

UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)

Pads

41

SMD

6.2×6.2

Boards

—

Package_DFN_QFN

UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)

Pads

49

SMD

7.2×7.2

Boards

—

Package_DFN_QFN

PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)

Pads

28

SMD

5.1×5.1

Boards

—

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads

41

SMD

6.3×6.3

Boards

—

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads

9

SMD

5.2×3.5

Boards

—

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads

21

SMD

5.3×5.3

Boards

—

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads

39

SMD

6.2×8.2

Boards

—

Package_QFP

LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)

Pads

53

SMD

13.3×13.3

Boards

—

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads

45

SMD

13.3×13.3

Boards

—

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads

49

SMD

10.3×10.3

Boards

—

Package_QFP

TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)

Pads

53

SMD

13.3×13.3

Boards

—

Package_QFP

TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)

Pads

65

SMD

13.5×13.5

Boards

—

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads

81

SMD

17.4×17.4

Boards

—

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads

21

SMD

7.9×7.1

Boards

—

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads

29

SMD

7.3×10.3

Boards

—

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads

39

SMD

9.5×13.0

Boards

—

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads

13

SMD

6.3×4.5

Boards

—

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads

11

SMD

7.5×5.4

Boards

—

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads

25

SMD

12.1×10.8

Boards

—

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads

37

SMD

12.1×10.8

Boards

—

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

15

SMD

7.8×5.5

Boards

—

Package_SON

Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)

Pads

11

SMD

4.2×3.5

Boards

—

Package_SON

VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))

Pads

11

SMD

4.3×3.5

Boards

—

Package_SON

WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)

Pads

11

SMD

5.3×4.5

Boards

—