Footprints

159 footprints matching “vias”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

159 footprints · page 7 of 7

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TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: —

TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)

Pads: 53
SMD: 13.3×13.3
Boards: —

TQFP-64-1EP_10x10mm_P0.5mm_EP5.305x5.305mm_ThermalVias

FP3D

Package_QFP

TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)

Pads: 65
SMD: 13.5×13.5
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads: 81
SMD: 17.4×17.4
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads: 39
SMD: 9.5×13.0
Boards: —

MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads: 13
SMD: 6.3×4.5
Boards: —

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: —

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —