Footprints

6,646 footprints matching “P”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

6,646 footprints · page 9 of 277

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VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

CP_Elec_6.3x5.4

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Panasonic C55, 6.3x5.4mm

Pads: 2
SMD: 9.6×7.1
Boards: 154

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

CP_EIA-3528-21_Kemet-B

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 4.9×3.3
Boards: 149

D_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 4.9×2.3
Boards: 148

SO-14_3.9x8.65mm_P1.27mm

FP3D

Package_SO

SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 147

D_0603_1608Metric_Pad1.05x0.95mm_HandSolder

FP3D

Diode_SMD

Diode SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 3.3×1.5
Boards: 145

JST_EH_B4B-EH-A_1x04_P2.50mm_Vertical

FP3D

Connector_JST

JST EH series connector, B4B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf)

Pads: 4
THT: 13.5×4.8
Boards: 144

CP_Elec_10x10

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Nichicon, 10.0x10.0mm

Pads: 2
SMD: 12.5×10.8
Boards: 143

PinHeader_2x07_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x07, 2.54mm pitch, double rows

Pads: 14
THT: 6.1×18.8
Boards: 143

IDC-Header_2x08_P2.54mm_Vertical

FP3D

Connector_IDC

Through hole IDC box header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0

Pads: 16
THT: 9.9×29.0
Boards: 142

SO-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 141

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

PinHeader_1x05_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x05, 2.54mm pitch, 6mm pin length, single row

Pads: 5
THT: 12.3×13.7
Boards: 139

PinHeader_2x01_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x01, 2.54mm pitch, double rows

Pads: 2
THT: 6.1×3.5
Boards: 139

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

CP_EIA-7343-31_Kemet-D

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-D (7343-31 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 8.8×4.8
Boards: 137