Footprints

136 footprints matching “0.4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

136 footprints · page 1 of 6

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 381

SOP-16_4.4x10.4mm_P1.27mm

FP3D

Package_SO

SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)

Pads: 16
SMD: 8.5×10.9
Boards: 45

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 24

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads: 41
SMD: 6.2×6.2
Boards: 18

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads: 41
SMD: 6.2×6.2
Boards: 15

UQFN-10_1.4x1.8mm_P0.4mm

FP3D

Package_DFN_QFN

UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)

Pads: 10
SMD: 2.6×3.0
Boards: 15

DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP3D

Package_DFN_QFN

DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)

Pads: 15
SMD: 4.0×3.6
Boards: 14

QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)

Pads: 25
SMD: 4.3×4.3
Boards: 13

WLP-4_0.86x0.86mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.86x0.86mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-0612.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads: 4
SMD: 2.9×2.9
Boards: 12

USON-20_2x4mm_P0.4mm

FP3D

Package_SON

USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf

Pads: 20
SMD: 3.3×4.5
Boards: 12

QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)

Pads: 33
SMD: 5.2×5.2
Boards: 10

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads: 33
SMD: 5.2×5.2
Boards: 9

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9

D_SOD-882D

FP3D

Diode_SMD

SOD-882D, DFN1006D-2, body 1.0 x 0.6 x 0.4mm, pitch 0.65mm, https://assets.nexperia.com/documents/package-information/SOD882D.pdf

Pads: 2
SMD: 1.8×1.2
Boards: 6

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 19.0×19.0
Boards: 5