Footprints
74 footprints matching “0.8mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-32_7x7mm_P0.8mm
Package_QFP
TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)
- Pads
- 32
- SMD
- 10.3×10.3
- Boards
- 503
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-32_7x7mm_P0.8mm
Package_QFP
LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf)
- Pads
- 32
- SMD
- 10.4×10.4
- Boards
- 185
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y
Package_LGA
LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf)
- Pads
- 14
- SMD
- 3.5×5.5
- Boards
- 50
TSOP-II-44_10.16x18.41mm_P0.8mm
Package_SO
TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 44
- SMD
- 13.2×18.9
- Boards
- 47
Texas_DRT-3
Package_TO_SOT_SMD
Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf
- Pads
- 3
- SMD
- 1.6×1.4
- Boards
- 39
Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering
Package_LGA
Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)
- Pads
- 8
- SMD
- 3.5×3.5
- Boards
- 38
TestPoint_Bridge_Pitch2.54mm_Drill1.0mm
TestPoint
wire loop as test point, pitch 2.54mm, hole diameter 1.0mm, wire diameter 0.8mm
- Pads
- 1
- THT
- 5.5×3.0
- Boards
- 35
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD
Package_BGA
BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 256
- SMD
- 16.0×16.0
- Boards
- 23
TQFP-64_14x14mm_P0.8mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)
- Pads
- 64
- SMD
- 17.3×17.3
- Boards
- 18
BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm
Package_BGA
BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf
- Pads
- 96
- SMD
- 11.0×15.0
- Boards
- 15
L_Radial_D12.5mm_P7.00mm_Fastron_09HCP
Inductor_THT
Inductor, Radial series, Radial, pin pitch=7.00mm, diameter=12.5mm, height=10.8mm, Fastron, 09HCP, http://cdn-reichelt.de/documents/datenblatt/B400/DS_09HCP.pdf
- Pads
- 2
- THT
- 13.0×13.0
- Boards
- 10
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
TFBGA-100_8x8mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199
- Pads
- 100
- SMD
- 10.0×10.0
- Boards
- 8
PQFP-44_10x10mm_P0.8mm
Package_QFP
PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)
- Pads
- 44
- SMD
- 14.5×14.5
- Boards
- 7
TFBGA-100_9.0x9.0mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm
- Pads
- 100
- SMD
- 11.0×11.0
- Boards
- 3
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- 3
PQFP-80_14x20mm_P0.8mm
Package_QFP
PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 80
- SMD
- 18.5×24.5
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
L_CommonMode_Toroid_Vertical_L19.3mm_W10.8mm_Px6.35mm_Py15.24mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=6.35*15.24mm^2, length*width=19.304*10.795mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 19.8×11.3
- Boards
- 1