Footprints

312 footprints matching “14”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

312 footprints · page 1 of 13

Matched by name and keywords. Search by meaning instead

D_SMA

FP3D

Diode_SMD

Diode SMA (DO-214AC)

Pads: 2
SMD: 7.0×3.5
Boards: 1,465

SOIC-14_3.9x8.7mm_P1.27mm

FP3D

Package_SO

SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 908

DIP-14_W7.62mm

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 14
THT: 9.7×18.3
Boards: 626

TSSOP-14_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 14
SMD: 7.7×5.5
Boards: 507

D_SMB

FP3D

Diode_SMD

Diode SMB (DO-214AA)

Pads: 2
SMD: 7.3×4.5
Boards: 413

DIP-14_W7.62mm_Socket

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 14
THT: 10.7×18.4
Boards: 391

SOT-143

FP3D

Package_TO_SOT_SMD

SOT-143 https://www.nxp.com/docs/en/package-information/SOT143B.pdf

Pads: 4
SMD: 3.2×3.4
Boards: 308

D_SMA_Handsoldering

FP3D

Diode_SMD

Diode SMA (DO-214AC) Handsoldering

Pads: 2
SMD: 9.0×3.5
Boards: 273

LQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)

Pads: 100
SMD: 17.5×17.5
Boards: 273

DIP-14_W7.62mm_Socket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

DIP-14_W7.62mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

D_SMC

FP3D

Diode_SMD

Diode SMC (DO-214AB)

Pads: 2
SMD: 9.8×6.7
Boards: 177

SO-14_3.9x8.65mm_P1.27mm

FP3D

Package_SO

SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 147

CP_Radial_D8.0mm_P3.80mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=3.80mm, diameter=8mm, height=14mm, Electrolytic Capacitor

Pads: 2
THT: 8.5×8.5
Boards: 130

Oscillator_DIP-14

FP3D

Oscillator

Oscillator, DIP14, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 21.2×13.2
Boards: 130

D_SMB_Handsoldering

FP3D

Diode_SMD

Diode SMB (DO-214AA) Handsoldering

Pads: 2
SMD: 9.4×4.5
Boards: 125

PinHeader_1x14_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x14, 2.54mm pitch, single row

Pads: 14
THT: 3.5×36.6
Boards: 123

LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)

Pads: 14
SMD: 3.5×3.0
Boards: 118

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93