Footprints
23 footprints matching “3x1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
C_1206_3216Metric_Pad1.33x1.80mm_HandSolder
Capacitor_SMD
Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 5.0×2.3
- Boards
- 1,130
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
SOIC-16W_5.3x10.2mm_P1.27mm
Package_SO
SOIC, 16 Pin (http://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 57
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
TerminalBlock_Phoenix_MKDS-3-4-5.08_1x04_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-3-4-5.08, 4 pins, pitch 5.08mm, size 20.3x11.2mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/2138224.pdf
- Pads
- 4
- THT
- 21.3×12.2
- Boards
- 23
BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm
Package_BGA
BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf
- Pads
- 96
- SMD
- 11.0×15.0
- Boards
- 15
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
TFBGA-216_13x13mm_Layout15x15_P0.8mm
Package_BGA
TFBGA-216, 13.0x13.0mm, 216 Ball, 15x15 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=219
- Pads
- 216
- SMD
- 15.0×15.0
- Boards
- 1
TerminalBlock_Phoenix_MKDS-3-16-5.08_1x16_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-3-16-5.08, 16 pins, pitch 5.08mm, size 81.3x11.2mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/2138224.pdf
- Pads
- 16
- THT
- 82.3×12.2
- Boards
- 1
DIN41612_C_3x16_Female_Vertical_THT
Connector_DIN
DIN41612 connector, type C, Vertical, 3 rows 32 pins wide, https://b2b.harting.com/files/livebooks/en/PRD0200000100063/downloads/livebook.pdf
- Pads
- 48
- THT
- 11.6×96.0
- Boards
- —
DIN41612_C_3x16_Male_Horizontal_THT
Connector_DIN
DIN41612 connector, type C, Horizontal, 3 rows 32 pins wide, https://b2b.harting.com/files/livebooks/en/PRD0200000100063/downloads/livebook.pdf
- Pads
- 48
- THT
- 95.0×19.6
- Boards
- —
BGA-84_10.5x13.0mm_Layout2x3x16_P0.8mm
muratovas-MAS_Package_std
BGA-84,
- Pads
- 90
- SMD
- 11.0×15.0
- Boards
- —
BGA-144_7.0x7.0mm_Layout13x13_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-144, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00346-00.pdf
- Pads
- 144
- SMD
- 9.0×9.0
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —
WSON-16_3.3x1.35_P0.4mm
Package_SON
WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument
- Pads
- 17
- SMD
- 2.2×3.8
- Boards
- —