Footprints

61 footprints matching “4.9”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

61 footprints · page 1 of 3

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SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 3,516

SO-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 380

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 135

SSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)

Pads: 16
SMD: 7.4×5.4
Boards: 98

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

QSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 16
SMD: 7.4×5.4
Boards: 45

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: 33

R_LDR_4.9x4.2mm_P2.54mm_Vertical

FP3D

OptoDevice

Resistor, LDR 4.9x4.2mm

Pads: 2
THT: 5.4×4.7
Boards: 28

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 28

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 25

SSOP-10_3.9x4.9mm_P1.00mm

FP3D

Package_SO

10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)

Pads: 10
SMD: 6.7×5.4
Boards: 25

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

CP_Elec_6.3x4.9

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm

Pads: 2
SMD: 9.6×7.1
Boards: 11

DSUB-9_Pins_Horizontal_P2.77x2.84mm_EdgePinOffset4.94mm_Housed_MountingHolesOffset4.94mm

FP3D

Connector_Dsub

9-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, pins (male), pitch 2.77x2.84mm, pin-PCB-offset 4.94mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 4.94mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf

Pads: 10
THT: 31.9×17.0
Boards: 11

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 11

JEITA_SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 8 Pin (JEITA/EIAJ ED-7311-19, variation 08-001-ADB, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=20)

Pads: 8
SMD: 7.3×5.4
Boards: 10

DSUB-15-HD_Socket_Horizontal_P2.29x1.90mm_EdgePinOffset3.03mm_Housed_MountingHolesOffset4.94mm

FP3D

Connector_Dsub

15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x1.9mm, pin-PCB-offset 3.03mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 4.94mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf

Pads: 16
THT: 31.9×16.0
Boards: 4

SOIC-8-N7_3.9x4.9mm_P1.27mm

FP3D

Package_SO

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)

Pads: 7
SMD: 7.5×5.4
Boards: 4

DSUB-25_Socket_Horizontal_P2.77x2.84mm_EdgePinOffset4.94mm_Housed_MountingHolesOffset4.94mm

FP3D

Connector_Dsub

25-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.77x2.84mm, pin-PCB-offset 4.94mm, distance of mounting holes 47.1mm, distance of mounting holes to PCB edge 4.94mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf

Pads: 26
THT: 54.1×17.2
Boards: 3

RV_Disc_D7mm_W4.9mm_P5mm

FP3D

Varistor

Varistor, diameter 7mm, width 4.9mm, pitch 5mm

Pads: 2
THT: 7.5×5.4
Boards: 3

DSUB-9_Socket_Horizontal_P2.77x2.84mm_EdgePinOffset4.94mm_Housed_MountingHolesOffset4.94mm

FP3D

Connector_Dsub

9-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.77x2.84mm, pin-PCB-offset 4.94mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 4.94mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf

Pads: 10
THT: 31.9×17.2
Boards: 2