Footprints
62 footprints matching “44”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-16_4.4x5mm_P0.65mm
Package_SO
TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 16
- SMD
- 7.7×5.5
- Boards
- 579
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
TQFP-144_20x20mm_P0.5mm
Package_QFP
TQFP, 144 Pin (JEDEC MS-026 variation AFB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 52
TSOP-II-44_10.16x18.41mm_P0.8mm
Package_SO
TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 44
- SMD
- 13.2×18.9
- Boards
- 47
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 13
POM-2244P-C3310-2-R
Sensor_Audio
Electret Condenser microphone, Project Unlimited (PU) Audio, https://api.puiaudio.com/file/b7e03aec-9603-48da-8064-9a0e0468047c.pdf
- Pads
- 2
- THT
- 6.5×6.5
- Boards
- 11
Indicator_PUI_AI-1440-TWT-24V-2-R
Buzzer_Beeper
14mm Indicator, https://www.puiaudio.com/media/SpecSheet/AI-1440-TWT-24V-2-R.pdf
- Pads
- 2
- THT
- 14.3×14.3
- Boards
- 8
PQFP-44_10x10mm_P0.8mm
Package_QFP
PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)
- Pads
- 44
- SMD
- 14.5×14.5
- Boards
- 7
HDMI_A_Amphenol_10029449-x01xLF_Horizontal
Connector_Video
HDMI Type A connector, Amphenol 10029449-001TLF 10029449-001RLF 10029449-101TLF 10029449-101RLF, Right Angle(https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10029449.pdf)
- Pads
- 20
- SMD
- 18.5×11.4
- Boards
- 4
DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm
Package_DFN_QFN
DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)
- Pads
- 17
- SMD
- 5.0×5.6
- Boards
- 4
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
L_Radial_L16.1mm_W16.1mm_Px7.62mm_Py12.70mm_Pulse_LP-44
Inductor_THT
Inductor, Radial series, Radial, pin pitch=7.62*12.70mm^2, length*width=16.13*16.13mm^2, Pulse, LP-44, http://datasheet.octopart.com/PE-54044NL-Pulse-datasheet-5313493.pdf
- Pads
- 2
- THT
- 16.6×16.6
- Boards
- 2
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
Transformer_37x44
Transformer_THT
transformer 37x44mm²
- Pads
- 4
- THT
- 43.7×38.6
- Boards
- 2
CP_Axial_L38.0mm_D21.0mm_P44.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=44mm, length*diameter=38*21mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/28325/021asm.pdf
- Pads
- 2
- THT
- 46.9×21.5
- Boards
- 1
DSUB-44-HD_Socket_Horizontal_P2.29x2.54mm_EdgePinOffset8.35mm_Housed_MountingHolesOffset10.89mm
Connector_Dsub
44-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x2.54mm, pin-PCB-offset 8.35mm, distance of mounting holes 47.1mm, distance of mounting holes to PCB edge 10.89mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf
- Pads
- 45
- THT
- 54.1×22.6
- Boards
- 1
TE_440054-2_1x02_P2.00mm_Vertical
Connector_TE-Connectivity
TE Connectivity, HDI, Wire-to-Board, Fully Shrouded, Vertical Header: https://www.te.com/usa-en/product-440054-2.datasheet.pdf
- Pads
- 2
- THT
- 7.0×5.7
- Boards
- 1
BGA-144_13.0x13.0mm_Layout12x12_P1.0mm
Package_BGA
BGA-144, http://www.topline.tv/drawings/pdf/BGA%201,0mm%20pitch/LBGA144T1.0-DC128.pdf
- Pads
- 144
- SMD
- 15.0×15.0
- Boards
- 1
LFBGA-144_10x10mm_Layout12x12_P0.8mm
Package_BGA
LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114
- Pads
- 144
- SMD
- 12.0×12.0
- Boards
- 1
TQFN-44-1EP_7x7mm_P0.5mm_EP4.7x4.7mm
Package_DFN_QFN
TQFN, 44 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 1