Footprints

23 footprints matching “75mm

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

23 footprints

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R_1206_3216Metric_Pad1.30x1.75mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads
2
SMD
4.9×2.3
Boards
1,111

LED_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

LED_SMD

LED SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
4.9×2.3
Boards
416

Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Fuse

Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
4.9×2.3
Boards
275

D_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
4.9×2.3
Boards
148

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads
9
SMD
2.8×2.5
Boards
20

D_2114_3652Metric_Pad1.85x3.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)

Pads
2
SMD
6.9×4.3
Boards
10

TO-218-3_Vertical

FP3D

Package_TO_SOT_THT

TO-218-3, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf

Pads
3
THT
15.4×5.4
Boards
8

C_Disc_D12.0mm_W4.4mm_P7.75mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=7.75mm, diameter*width=12*4.4mm^2, Capacitor

Pads
2
THT
12.5×4.9
Boards
3

QFN-28-1EP_3x6mm_P0.5mm_EP1.7x4.75mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081926_0_UDE28.pdf)

Pads
29
SMD
4.3×7.3
Boards
2

UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads
17
SMD
4.3×4.3
Boards
2

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads
21
SMD
5.3×5.3
Boards
1

CP_Axial_L67.0mm_D23.0mm_P75.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=75mm, length*diameter=67*23.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
77.9×23.5
Boards

CP_Axial_L67.0mm_D26.0mm_P75.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=75mm, length*diameter=67*26mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
77.9×26.5
Boards

CP_Axial_L67.0mm_D29.0mm_P75.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=75mm, length*diameter=67*29.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
77.9×29.5
Boards

CP_Axial_L67.0mm_D32.0mm_P75.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=75mm, length*diameter=67*32.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
77.9×32.5
Boards

CP_Axial_L67.0mm_D35.0mm_P75.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=75mm, length*diameter=67*35.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
77.9×35.5
Boards

L_Radial_D21.0mm_P15.75mm_Vishay_IHB-2

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=15.75mm, diameter=21mm, height=21.34mm, Vishay, IHB-2, http://www.vishay.com/docs/34015/ihb.pdf

Pads
2
THT
21.5×21.5
Boards

QFN-28-1EP_3x6mm_P0.5mm_EP1.7x4.75mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081926_0_UDE28.pdf)

Pads
29
SMD
4.3×7.3
Boards

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads
21
SMD
5.3×5.3
Boards

VSO-56_11.1x21.5mm_P0.75mm

FP3D

Package_SO

VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)

Pads
56
SMD
16.6×22.2
Boards

R_1218_3246Metric_Pad1.22x4.75mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 1218 (3246 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf)

Pads
2
SMD
4.9×5.3
Boards

R_Axial_Power_L75.0mm_W9.0mm_P81.28mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=81.28mm, 17W, length*width*height=75*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
84.2×9.5
Boards

R_Axial_Power_L75.0mm_W9.0mm_P86.36mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=86.36mm, 17W, length*width*height=75*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
89.3×9.5
Boards