Footprints

84 footprints matching “8-pin

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

84 footprints · page 1 of 4

Matched by name and keywords. Search by meaning instead

SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads
8
SMD
7.4×5.4
Boards
3,516

SO-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)

Pads
8
SMD
7.4×5.4
Boards
380

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads
8
SMD
6.4×3.5
Boards
348

TSSOP-8_4.4x3mm_P0.65mm

FP3D

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
8
SMD
7.7×3.5
Boards
179

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads
8
SMD
4.6×2.5
Boards
156

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads
8
SMD
9.3×5.8
Boards
139

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads
9
SMD
7.4×5.4
Boards
135

SOT-23-8

FP3D

Package_TO_SOT_SMD

SOT, 8 Pin (JEDEC MO-178 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads
8
SMD
4.1×3.4
Boards
128

R_Array_SIP8

FP3D

Resistor_THT

8-pin Resistor SIP pack

Pads
8
THT
21.0×3.1
Boards
70

WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm

FP3D

Package_SON

WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))

Pads
9
SMD
6.7×5.5
Boards
68

DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)

Pads
9
SMD
4.3×2.5
Boards
47

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads
9
SMD
8.4×5.5
Boards
47

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads
9
SMD
7.4×5.4
Boards
40

Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm

FP3D

Package_SON

Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)

Pads
9
SMD
4.3×2.5
Boards
39

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads
8
SMD
3.5×3.5
Boards
38

SSOP-8_3.9x5.05mm_P1.27mm

FP3D

Package_SO

SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)

Pads
8
SMD
7.4×5.6
Boards
34

TSOT-23-8

FP3D

Package_TO_SOT_SMD

TSOT, 8 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA)

Pads
8
SMD
4.1×3.4
Boards
30

VSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads
8
SMD
6.4×3.5
Boards
29

SOT-23-8_Handsoldering

FP3D

Package_TO_SOT_SMD

8-pin SOT-23 package, Handsoldering, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot-23rj/rj_8.pdf

Pads
8
SMD
4.8×3.6
Boards
29

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads
9
SMD
7.4×5.4
Boards
28

Molex_KK-254_AE-6410-08A_1x08_P2.54mm_Vertical

FP3D

Connector_Molex

Molex KK-254 Interconnect System, old/engineering part number: AE-6410-08A example for new part number: 22-27-2081, 8 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf)

Pads
8
THT
21.3×6.8
Boards
26

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads
9
SMD
7.4×5.4
Boards
25

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads
9
SMD
7.4×5.4
Boards
20

SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads
8
SMD
13.0×6.4
Boards
17