Footprints
16 footprints matching “85mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Diode_Bridge_Round_D9.0mm
Diode_THT
4-lead round diode bridge package, diameter 9.0mm, pin pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf
- Pads
- 4
- THT
- 10.6×10.6
- Boards
- 19
SOIC-8_7.5x5.85mm_P1.27mm
Package_SO
SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)
- Pads
- 8
- SMD
- 13.0×6.4
- Boards
- 17
TestPoint_Loop_D2.50mm_Drill1.85mm
TestPoint
wire loop as test point, loop diameter 2.5mm, hole diameter 1.85mm
- Pads
- 1
- THT
- 4.4×4.4
- Boards
- 7
Diode_Bridge_Round_D8.9mm
Diode_THT
4-lead round diode bridge package, diameter 8.9mm, pin pitch 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF
- Pads
- 4
- THT
- 8.4×9.3
- Boards
- 5
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 1
CP_Axial_L80.0mm_D23.0mm_P85.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=85mm, length*diameter=80*23.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf
- Pads
- 2
- THT
- 87.9×23.5
- Boards
- —
CP_Axial_L80.0mm_D26.0mm_P85.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=85mm, length*diameter=80*26mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf
- Pads
- 2
- THT
- 87.9×26.5
- Boards
- —
CP_Axial_L80.0mm_D29.0mm_P85.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=85mm, length*diameter=80*29.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf
- Pads
- 2
- THT
- 87.9×29.5
- Boards
- —
CP_Axial_L80.0mm_D32.0mm_P85.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=85mm, length*diameter=80*32.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf
- Pads
- 2
- THT
- 87.9×32.5
- Boards
- —
CP_Axial_L80.0mm_D35.0mm_P85.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=85mm, length*diameter=80*35.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf
- Pads
- 2
- THT
- 87.9×35.5
- Boards
- —
L_TDK_MLZ2012_h0.85mm
Inductor_SMD
Inductor, TDK, MLZ2012_h0.85mm, 2.0x1.25x0.85mm, ( "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf")
- Pads
- 2
- SMD
- 3.1×1.8
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —