Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TO-92_Inline
Package_TO_SOT_THT
TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.5×4.7
- Boards
- 988
DIP-8_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 8
- THT
- 9.7×10.7
- Boards
- 956
DIP-16_W7.62mm
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 16
- THT
- 9.7×20.8
- Boards
- 708
DIP-14_W7.62mm
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 14
- THT
- 9.7×18.3
- Boards
- 626
DIP-14_W7.62mm_Socket
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 14
- THT
- 10.7×18.4
- Boards
- 391
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 381
DIP-16_W7.62mm_Socket
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- 373
TO-92_Inline_Wide
Package_TO_SOT_THT
TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 7.1×4.7
- Boards
- 358
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
DIP-8_W7.62mm_Socket
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 8
- THT
- 10.7×10.8
- Boards
- 322
DIP-20_W7.62mm
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 20
- THT
- 9.7×25.9
- Boards
- 318
DIP-28_W7.62mm
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 28
- THT
- 9.7×36.1
- Boards
- 301
DIP-40_W15.24mm
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 40
- THT
- 17.3×51.3
- Boards
- 272
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
DIP-4_W7.62mm
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 4
- THT
- 9.7×5.6
- Boards
- 252
DIP-8_W7.62mm_LongPads
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 8
- THT
- 10.5×10.7
- Boards
- 242
DIP-20_W7.62mm_Socket
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 20
- THT
- 10.7×26.0
- Boards
- 227
DIP-14_W7.62mm_Socket_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 14
- THT
- 10.7×18.4
- Boards
- 225
DIP-14_W7.62mm_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 14
- THT
- 10.5×18.3
- Boards
- 205
DIP-16_W7.62mm_LongPads
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 16
- THT
- 10.5×20.8
- Boards
- 199
DIP-16_W7.62mm_Socket_LongPads
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- 189
TO-92
Package_TO_SOT_THT
TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.5×4.7
- Boards
- 181
DIP-40_W15.24mm_Socket
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 40
- THT
- 18.3×51.4
- Boards
- 179
DIP-8_W7.62mm_Socket_LongPads
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 8
- THT
- 10.7×10.8
- Boards
- 178
