Footprints
253 footprints matching “42”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-42-1EP_5x6mm_P0.4mm_EP3.7x4.7mm
Package_DFN_QFN
QFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf)
- Pads
- 43
- SMD
- 6.3×7.3
- Boards
- —
QFN-42-1EP_5x6mm_P0.4mm_EP3.7x4.7mm_ThermalVias
Package_DFN_QFN
QFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf)
- Pads
- 43
- SMD
- 6.3×7.3
- Boards
- —
WQFN-42-1EP_3.5x9mm_P0.5mm_EP2.05x7.55mm_ThermalVias
Package_DFN_QFN
WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23, https://www.diodes.com/assets/Package-Files/PD-2035J_ZH42.pdf)
- Pads
- 43
- SMD
- 4.8×10.3
- Boards
- —
DIP-42_W15.24mm_LongPads
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 42
- THT
- 18.1×53.9
- Boards
- —
DIP-42_W15.24mm_SMDSocket_SmallPads
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), SMDSocket, SmallPads
- Pads
- 42
- SMD
- 18.3×54.0
- Boards
- —
DIP-42_W15.24mm_Socket
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 42
- THT
- 18.3×54.0
- Boards
- —
DIP-42_W16.51mm_SMDSocket_LongPads
Package_DIP
42-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 42
- SMD
- 20.1×54.0
- Boards
- —
SMDIP-42_W15.24mm
Package_DIP
42-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 42
- SMD
- 17.8×53.8
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
TO-263-4
Package_TO_SOT_SMD
TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/
- Pads
- 5
- SMD
- 16.6×11.3
- Boards
- —
TO-263-6
Package_TO_SOT_SMD
TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/
- Pads
- 7
- SMD
- 16.6×11.3
- Boards
- —
ublox_SARA_LGA-96
RF_GSM
ublox SARA cellular/GNSS module, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162
- Pads
- 96
- SMD
- 16.5×26.5
- Boards
- —
Mini-Circuits_CD542_LandPatternPL-094
RF_Mini-Circuits
Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf)
- Pads
- 6
- SMD
- 10.5×8.4
- Boards
- —
NINA-B111
RF_Module
NINA-B111 LGA module 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30
- Pads
- 42
- SMD
- 10.8×11.1
- Boards
- —
RAK4200
RF_Module
RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf
- Pads
- 20
- SMD
- 17.1×16.5
- Boards
- —
Raytac_MDBT42Q
RF_Module
Multiprotocol radio SoC module https://www.raytac.com/download/index.php?index_id=27
- Pads
- 41
- SMD
- 11.1×17.1
- Boards
- —
RN42N
RF_Module
Class 2 Bluetooth Module without antenna
- Pads
- 36
- SMD
- 15.3×21.9
- Boards
- —
DIP_Socket-20_W4.3mm_W5.08mm_W7.62mm_W10.16mm_W10.9mm_3M_220-3342-00-0602J
Socket
3M 20-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
- Pads
- 20
- THT
- 17.4×53.7
- Boards
- —
DIP_Socket-42_W11.9mm_W12.7mm_W15.24mm_W17.78mm_W18.5mm_3M_242-1281-00-0602J
Socket
3M 42-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
- Pads
- 42
- THT
- 25.1×81.5
- Boards
- —
CE-Logo_42x30mm_SilkScreen
Symbol
CE marking
- Pads
- —
- Mount
- exclude_from_pos_files
- Boards
- —
TerminalBlock_RND_205-00242_1x03_P10.16mm_Horizontal
TerminalBlock_RND
terminal block RND 205-00242, 3 pins, pitch 10.2mm, size 25.4x8.3mm, drill diameter 1.3mm, pad diameter 2.5mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf
- Pads
- 3
- THT
- 26.4×9.3
- Boards
- —
TerminalBlock_RND_205-00242_1x12_P5.08mm_Horizontal
TerminalBlock_RND
terminal block RND 205-00242, 12 pins, pitch 5.08mm, size 61x8.45mm, drill diameter 1.1mm, pad diameter 2.1mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf
- Pads
- 12
- THT
- 62.0×9.4
- Boards
- —
TerminalBlock_WAGO_236-108_1x08_P5.00mm_45Degree
TerminalBlock_WAGO
Terminal Block WAGO 236-108, 45Degree (cable under 45degree), 8 pins, pitch 5mm, size 42.3x14mm, drill diameter 1.15mm, pad diameter 3mm,
- Pads
- 8
- THT
- 43.3×15.0
- Boards
- —