Footprints
812 footprints matching “MS”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Analog MSOP-16EP
celestial-altium-Leaded_SOP
MSOP-16EP Package, 0.5mm Pitch, 4.03x3.00mm Body
- Pads
- 16
- SMD
- 4.5×5.7
- Boards
- —
ANALOG MSOP-8 MS8 3x3MM
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- —
ANALOG MSOP-8 RM-8
celestial-altium-Leaded_SOP
- Pads
- 8
- SMD
- 6.3×3.7
- Boards
- —
DIODES MSOP-8EP
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.00x1.70mm, IPC Medium Density
- Pads
- 9
- SMD
- 6.2×3.6
- Boards
- —
INTERSIL MSOP-8 M8.118
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density
- Pads
- 8
- SMD
- 6.3×3.6
- Boards
- —
LT MSOP-8 MS8E 3x3MM
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density
- Pads
- 9
- SMD
- 6.3×3.6
- Boards
- —
LTC MSOP-16 MSE16
celestial-altium-Leaded_SOP
16-Lead Plastic MSOP, Exposed Die Pad
- Pads
- 17
- SMD
- 6.0×4.4
- Boards
- —
MAXIM MSOP-8 uMAX
celestial-altium-Leaded_SOP
TSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.52x2.18mm, IPC Medium Density
- Pads
- 8
- SMD
- 6.1×3.4
- Boards
- —
MICROCHIP MSOP-10 UN
celestial-altium-Leaded_SOP
MSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, IPC Medium Density
- Pads
- 10
- SMD
- 6.3×3.6
- Boards
- —
MICROCHIP MSOP-8 MS
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density
- Pads
- 8
- SMD
- 6.3×3.5
- Boards
- —
TI MSOP-10 DGQ
celestial-altium-Leaded_SOP
TSSOP, 10-Leads, Body 3x3mm, Pitch 0.5mm, Thermal Pad 1.88x1.57mm, IPC Medium Density
- Pads
- 11
- SMD
- 6.3×3.6
- Boards
- —
TI MSOP-10 DGS
celestial-altium-Leaded_SOP
MSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, IPC Medium Density
- Pads
- 10
- SMD
- 6.3×3.6
- Boards
- —
TI MSOP-8 DGN
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.1x3.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 9
- SMD
- 6.3×3.6
- Boards
- —
TI MSOP-8 DGS
celestial-altium-Leaded_SOP
MSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density
- Pads
- 8
- SMD
- 7.8×3.6
- Boards
- —
MICROCHIP SMSC SQFN-32 5x5MM
celestial-altium-Leadless_QFN
QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.30x3.30mm, IPC Medium Density
- Pads
- 33
- SMD
- 6.1×6.1
- Boards
- —
SMSC QFN-24 4x4MM
celestial-altium-Leadless_QFN
QFN, 24-Leads, Body 4.1x4.1mm (max), Pitch 0.50mm, IPC Medium Density
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- —
SAMSUNG LM281BPLUS
celestial-altium-LED
- Pads
- 2
- SMD
- 4.2×3.4
- Boards
- —
MASACH MS243-10C
celestial-altium-RF_Shield
24.3 x 8.9 x 3.8mm Two-piece Drawn-Seamless RF Shield / EMI Shield COVER
- Pads
- —
- Mount
- 1.0×1.0
- Boards
- —
MASACH MS243-10F
celestial-altium-RF_Shield
24.3 x 8.9 x 3.8mm Two-piece Drawn-Seamless RF Shield / EMI Shield FRAME
- Pads
- 1
- SMD
- 26.2×10.8
- Boards
- —
MEAS SPEC MS5611-01BA03
celestial-altium-SpecialisedSensor
LCC, 8-Pins, Body 3.0x5.1mm (max), Pitch 1.25mm, IPC Medium Density
- Pads
- 8
- SMD
- 4.3×6.1
- Boards
- —
NKK MS12ASG13
celestial-altium-Switch
- Pads
- 4
- THT
- 17.0×7.5
- Boards
- —
WR-MMCX_Wuerth_66011102111302_Horizontal
Connector_Coaxial
Würth WR-MMCX PCB SMT Jack, Horizontal (https://www.we-online.com/components/products/datasheet/66011102111302.pdf)
- Pads
- 2
- SMD
- 5.2×5.2
- Boards
- —
WR-MMCX_Wuerth_66012102111404_Vertical
Connector_Coaxial
Würth WR-MMCX PCB SMT Jack, Vertical (https://www.we-online.com/components/products/datasheet/66012102111404.pdf)
- Pads
- 2
- SMD
- 5.2×5.2
- Boards
- —
Harwin_Gecko_G125-MS10605M2P_2x03_P1.25mm_Vertical
Connector_Harwin
Harwin Male Vertical Surface Mount Double Row 1.25mm (0.049 inch) Pitch PCB Connector, G125-MS10605M2P, 3 Pins per row (https://cdn.harwin.com/pdfs/G125-MS1XX05M2P.pdf)
- Pads
- 7
- SMD
- 16.2×6.8
- Boards
- —