Footprints

719 footprints matching “Thermal”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

719 footprints · page 10 of 30

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TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias

FP—

Package_SO

TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)

Pads: 29
SMD: 7.8×10.2
Boards: 1

ST_PowerFLAT-6L_5x6mm_P1.27mm

FP—

Package_SON

Thermally-enhanced 5x6mm 6-pin package, https://www.st.com/resource/en/datasheet/stl40dn3llh5.pdf

Pads: 6
SMD: 7.1×5.9
Boards: 1

Texas_DSC0010J_ThermalVias

FP—

Package_SON

3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 1

WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm_ThermalVias

FP—

Package_SON

WSON, 12 Pin (https://www.ti.com/lit/ds/symlink/tps63710.pdf#page=33)

Pads: 13
SMD: 4.3×3.5
Boards: 1

WSON-12-1EP_4x4mm_P0.5mm_EP2.6x3mm_ThermalVias

FP—

Package_SON

WSON, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62)

Pads: 13
SMD: 5.3×4.5
Boards: 1

ANALOG DEVICES TQFP_EP-100 SV-100-1

FP—

celestial-altium-Leaded_LQFP

TQFP_EP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, Thermal Pad 6.50x6.50mm, IPC Medium Density

Pads: 101
SMD: 17.3×17.3
Boards: —

INFINEON LQFP-144 PG-LQFP-144-24

FP—

celestial-altium-Leaded_LQFP

TSQFP, 144-Leads, Body 20.00x20.00mm, Pitch 0.50mm, Thermal Pad 7.60x7.60mm, IPC Medium Density

Pads: 145
SMD: 23.3×23.3
Boards: —

ST POWERSO-36

FP—

celestial-altium-Leaded_Misc

POWERSO, 36-Leads, Body 15.90x11.00mm, Pitch 0.65mm, Thermal Pad 9.80x6.20mm, IPC Medium Density

Pads: 37
SMD: 15.7×16.5
Boards: —

TI PDSO-10 DCQ

FP—

celestial-altium-Leaded_Misc

PDTSSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.88x1.57mm, IPC Medium Density

Pads: 11
SMD: 6.3×3.6
Boards: —

TI PDSO-14 PWP

FP—

celestial-altium-Leaded_Misc

TSOP, 14-Leads, Body 5.00x4.40mm, Pitch 0.65mm, Thermal Pad 5.00x3.40mm, IPC Medium Density

Pads: 15
SMD: 7.8×5.6
Boards: —

AD SOIC-8EP RD-8-1

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 2.39x2.39mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.5
Boards: —

AD SOIC-8EP RD-8-2

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.10x2.41mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.5
Boards: —

TI SOIC-8 DDA0008B

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 4.90x2.95mm, IPC Medium Density

Pads: 9
SMD: 8.4×5.5
Boards: —

TI SOIC-8 DDA0008E

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.10x2.40mm, IPC Medium Density

Pads: 9
SMD: 8.5×5.3
Boards: —

ALLEGRO TSSOP-16EP LP

FP—

celestial-altium-Leaded_SOP

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, Thermal Pad 3.00x3.00mm, IPC Medium Density

Pads: 17
SMD: 8.4×5.6
Boards: —

ALLEGRO TSSOP-24 LP

FP—

celestial-altium-Leaded_SOP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, Thermal Pad 4.32x3.00mm, IPC Medium Density

Pads: 25
SMD: 7.8×8.4
Boards: —

DIODES INC SO-8EP

FP—

celestial-altium-Leaded_SOP

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.60x2.70mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.6
Boards: —

DIODES MSOP-8EP

FP—

celestial-altium-Leaded_SOP

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.00x1.70mm, IPC Medium Density

Pads: 9
SMD: 6.2×3.6
Boards: —

MAXIM MSOP-8 uMAX

FP—

celestial-altium-Leaded_SOP

TSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.52x2.18mm, IPC Medium Density

Pads: 8
SMD: 6.1×3.4
Boards: —

ROHM HTSSOP-B28

FP—

celestial-altium-Leaded_SOP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.90mm, IPC Medium Density

Pads: 29
SMD: 7.8×10.3
Boards: —

ST HTSSOP-28

FP—

celestial-altium-Leaded_SOP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.80mm, IPC Medium Density

Pads: 29
SMD: 7.8×10.3
Boards: —

TI HTSSOP-14 PWP

FP—

celestial-altium-Leaded_SOP

HTSSOP, 14-Leads, Body 5.00x4.40mm, Pitch 0.65mm, Thermal Pad 3.10x3.00mm, IPC Medium Density

Pads: 15
SMD: 7.8×5.6
Boards: —

TI HTSSOP-20EP MHX

FP—

celestial-altium-Leaded_SOP

HTSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, Thermal Pad 4.20x3.00mm, IPC Medium Density

Pads: 21
SMD: 7.8×7.1
Boards: —

TI HTSSOP-28 PWP

FP—

celestial-altium-Leaded_SOP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 9.60x3.40mm, IPC Medium Density

Pads: 29
SMD: 7.8×10.3
Boards: —