Footprints
443 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIODES INC X2-DFN1006-3 N-FET
celestial-altium-Leadless_DFN
X2-DFN, 3-Leads, Body 0.60x1.00mm, Pitch 0.65mm
- Pads
- 3
- SMD
- 1.6×1.1
- Boards
- —
DIODES U-DFN2020-6E
celestial-altium-Leadless_DFN
U-DFN2020-6(E), 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.05x2.3mm, IPC High Density
- Pads
- 3
- SMD
- 2.7×2.4
- Boards
- —
LITTELFUSE IXYS DFN-8 M 3X3
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.70x2.05mm
- Pads
- 9
- SMD
- 4.2×3.8
- Boards
- —
MICROCHIP DFN-8 3X3MM
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.50x2.0mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×3.4
- Boards
- —
NEXPERIA DFN2020M-6 SOT1220-2 P-CH
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.49mm
- Pads
- 3
- SMD
- 2.8×2.6
- Boards
- —
NEXPERIA DFN2020MD-6 SOT1220 N-CH
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.49mm
- Pads
- 3
- SMD
- 2.8×2.6
- Boards
- —
NEXPERIA DFN2020MD-6 SOT1220 P-CH
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.49mm
- Pads
- 3
- SMD
- 2.8×2.6
- Boards
- —
ONSEMI WDFN6 2X2 511BR
celestial-altium-Leadless_DFN
WDFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.12x1.72mm, IPC Medium Density
- Pads
- 7
- SMD
- 2.6×2.4
- Boards
- —
ST DFN-8 3x3
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.20x1.70mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×4.2
- Boards
- —
NXP HVQFN-33 7x7mm
celestial-altium-Leadless_QFN
HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density
- Pads
- 33
- SMD
- 8.2×8.2
- Boards
- —
NXP HVQFN32 7x7mm SOT865-3
celestial-altium-Leadless_QFN
QFN, 32-Leads, Body 7.1x7.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 33
- SMD
- 8.2×8.2
- Boards
- —
QORVO RFSW6024
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.65mm, Thermal Pad 2.40x2.40mm
- Pads
- 17
- SMD
- 4.8×4.8
- Boards
- —
ST QFN-8 3x3
celestial-altium-Leadless_QFN
QFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.64x1.90mm, IPC Medium Density
- Pads
- 9
- SMD
- 3.6×3.5
- Boards
- —
TI PVQFN-16 4x4mm RSA
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
TI VQFN-16 4x4mm RGV
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
TI VQFN-16 4x4mm RSA
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
INFINEON PG-TSDSON-8
celestial-altium-Leadless_SON
PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density
- Pads
- 8
- SMD
- 4.5×3.8
- Boards
- —
INFINEON PG-TSDSON-8-32
celestial-altium-Leadless_SON
PG-TSDSON, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad, IPC Medium Density
- Pads
- 3
- SMD
- 3.9×4.5
- Boards
- —
INFINEON PG-TSON-8-1 3X3
celestial-altium-Leadless_SON
TSON, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.60x2.40mm
- Pads
- 9
- SMD
- 4.4×3.6
- Boards
- —
INFINEON PGTSON-8
celestial-altium-Leadless_SON
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.58mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×4.2
- Boards
- —
TI SON-6 Q2
celestial-altium-Leadless_SON
SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density
- Pads
- 8
- SMD
- 2.8×2.4
- Boards
- —
TI SON-8 Q3
celestial-altium-Leadless_SON
SON, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.90x2.45mm, IPC Medium Density
- Pads
- 8
- SMD
- 4.5×4.5
- Boards
- —
TI VSON-6 DRV
celestial-altium-Leadless_SON
SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 3.00x2.34mm, IPC Medium Density
- Pads
- 7
- SMD
- 2.8×2.4
- Boards
- —
TI VSON-8 DRB
celestial-altium-Leadless_SON
SON, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.65x2.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.3×4.3
- Boards
- —
