Footprints

251 footprints matching “35mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

251 footprints · page 11 of 11

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WFDFPN-8-1EP_3x2mm_P0.5mm_EP1.25x1.35mm

FP—

Package_DFN_QFN

WFDFPN, 8 Pin (https://www.st.com/resource/en/datasheet/m95512-r.pdf#page=34)

Pads: 9
SMD: 4.3×2.5
Boards: —

NXP_USON-8_1x1.35mm_P0.35mm

FP—

Package_LGA

NXP USON, 8 Pin (https://www.nxp.com/docs/en/package-information/SOT1203.pdf)

Pads: 8
SMD: 1.7×1.9
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads: 39
SMD: 9.5×13.0
Boards: —

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads: 39
SMD: 9.5×13.0
Boards: —

HTSSOP-44_6.1x14mm_P0.635mm_TopEP4.14x7.01mm

FP—

Package_SO

HTSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38)

Pads: 44
SMD: 9.5×14.5
Boards: —

WSON-16_3.3x1.35_P0.4mm

FP3D

Package_SON

WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument

Pads: 17
SMD: 2.2×3.8
Boards: —

Allegro_QSOP-24_3.9x8.7mm_P0.635mm

FP3D

Sensor_Current

Allegro Microsystems 24-Lead Plastic Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en)

Pads: 24
SMD: 7.8×9.2
Boards: —

TerminalBlock_MetzConnect_Type701_RT11L03HGLU_1x03_P6.35mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type701_RT11L03HGLU, 3 pins, pitch 6.35mm, size 19x12.5mm, drill diameter 1.3mm, pad diameter 2.5mm, https://www.metz-connect.com/externalfiles/317011/863830.PDF

Pads: 3
THT: 20.1×13.5
Boards: —

TestPoint_Bridge_Pitch6.35mm_Drill1.3mm

FP3D

TestPoint

wire loop as test point, pitch 6.35mm, hole diameter 1.3mm, wire diameter 1.0mm

Pads: 1
THT: 10.0×3.6
Boards: —