Footprints

2,987 footprints matching “P1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,987 footprints · page 115 of 125

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LGA-8_8x6.2mm_P1.27mm

FP—

Package_LGA

LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17)

Pads: 8
SMD: 9.2×6.7
Boards: —

Linear_LGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_LGA

Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 133
SMD: 15.5×15.5
Boards: —

ST_CCLGA-7L_2.8x2.8mm_P1.15mm_H1.95mm

FP—

Package_LGA

ST CCLGA, 7 Pin (https://www.st.com/resource/en/datasheet/ilps28qsw.pdf#page=44)

Pads: 7
SMD: 3.3×3.3
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: —

PQFP-128_28x28mm_P0.8mm

FP—

Package_QFP

PQFP, 128 Pin (JEITA/EIAJ ED-7311A (variation 128-001-KD) / JEDEC MS-022 (variation DB-2), 3.40mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=78, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)

Pads: 128
SMD: 32.5×32.5
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×18.2
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 20
SMD: 15.9×16.4
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm

FP—

Package_SO

HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf)

Pads: 11
SMD: 6.3×3.5
Boards: —

HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm_ThermalVias

FP—

Package_SO

HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf)

Pads: 11
SMD: 6.3×3.5
Boards: —

Infineon_SOIC-20W_7.6x12.8mm_P1.27mm

FP—

Package_SO

Infineon SOIC, 20 Pin (https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_SPO_PDF-Package-v15_00-EN.pdf?fileId=5546d4625c54d85b015c627e1a0c23b3, https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_FPD_PDF-Footprint-v15_00-EN.pdf?fileId=5546d4625c54d85b015c5f0f49614324)

Pads: 20
SMD: 11.9×13.3
Boards: —