Footprints

292 footprints matching “3.9”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

292 footprints · page 12 of 13

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SSOP-16_W3.90mm

FP—

digikey-Source_Footprints

Pads: 16
SMD: 8.0×5.5
Boards: —

SSOP-20_W3.9mm

FP—

digikey-Source_Footprints

http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf

Pads: 20
SMD: 7.2×9.4
Boards: —

L_Murata_DEM3512C

FP3D

Inductor_SMD

Inductor, Murata, DEM3512C, 3.9x3.7x1.2mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundferritetypeforpl/m_dem3512c.ashx)

Pads: 2
SMD: 4.8×4.2
Boards: —

L_Murata_DEM3518C

FP3D

Inductor_SMD

Inductor, Murata, DEM3518C, 3.9x3.7x1.8mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundferritetypeforpl/m_dem3518c.ashx)

Pads: 2
SMD: 4.8×4.2
Boards: —

L_Axial_L26.7mm_D14.0mm_P35.00mm_Horizontal_Vishay_IHA-104

FP—

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=35mm, length*diameter=26.67*13.97mm^2, Vishay, IHA-104, http://www.vishay.com/docs/34014/iha.pdf

Pads: 2
THT: 37.9×14.5
Boards: —

L_Axial_L29.9mm_D14.0mm_P7.62mm_Vertical_Vishay_IHA-105

FP—

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, length*diameter=29.85*13.97mm^2, Vishay, IHA-105, http://www.vishay.com/docs/34014/iha.pdf

Pads: 2
THT: 16.3×14.5
Boards: —

L_Radial_D24.4mm_P23.90mm_Murata_1400series

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=23.90mm, diameter=24.4mm, height=10.5mm, Murata, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf

Pads: 2
THT: 29.6×24.9
Boards: —

SOIC-14_L8.7-W3.9-P1.27-LS6.0-BL

FP—

jlcpcb-JLCPCB

SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 14
SMD: 7.4×9.2
Boards: —

SOIC-16_3.9x9.9mm_P1.27mm

FP—

jlcpcb-JLCPCB

SOIC, 16 Pin (JEDEC MS-012AC, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 16
SMD: 7.4×10.4
Boards: —

SOIC-8_3.9x4.9mm_P1.27mm

FP—

jlcpcb-JLCPCB

SOP, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=79), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 8
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

muratovas-MAS_Package_std

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 9
SMD: 7.4×5.4
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP—

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP—

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

ST_WLCSP-90_4.2x3.95mm_Layout18x10_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306

Pads: 90
SMD: 6.2×6.0
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

Infineon_PG-DSO-8-27_3.9x4.9mm_EP2.65x3mm_ThermalVias

FP—

Package_SO

Infineon PG-DSO, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27)

Pads: 9
SMD: 7.4×5.4
Boards: —

JEITA_SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)

Pads: 16
SMD: 7.7×10.4
Boards: —

OnSemi_751EP_SOIC-4_3.9x4.725mm_P2.54mm

FP—

Package_SO

OnSemi 751EP SOIC, 4 Pin (https://www.onsemi.com/pdf/datasheet/mb8s-d.pdf)

Pads: 4
SMD: 9.1×5.2
Boards: —

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads: 17
SMD: 7.3×5.4
Boards: —

SOIC-14-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)

Pads: 14
SMD: 7.4×10.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: —