Footprints

15,503 footprints matching “I”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

15,503 footprints · page 12 of 646

Matched by name and keywords. Search by meaning instead

PinHeader_2x07_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x07, 2.54mm pitch, double rows

Pads: 14
THT: 6.1×18.8
Boards: 143

IDC-Header_2x08_P2.54mm_Vertical

FP3D

Connector_IDC

Through hole IDC box header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0

Pads: 16
THT: 9.9×29.0
Boards: 142

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

PinHeader_1x05_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x05, 2.54mm pitch, 6mm pin length, single row

Pads: 5
THT: 12.3×13.7
Boards: 139

PinHeader_2x01_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x01, 2.54mm pitch, double rows

Pads: 2
THT: 6.1×3.5
Boards: 139

MountingHole_3.2mm_M3_ISO14580_Pad

FP—

MountingHole

Mounting Hole 3.2mm, M3, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 6.0×6.0
Boards: 139

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

ESD-Logo_6.6x6mm_SilkScreen

FP—

Symbol

Electrostatic discharge Logo

Pads: —
Mount: exclude_from_pos_files
Boards: 138

CP_EIA-7343-31_Kemet-D

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-D (7343-31 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 8.8×4.8
Boards: 137

U.FL_Molex_MCRF_73412-0110_Vertical

FP—

Connector_Coaxial

Molex Microcoaxial RF Connectors (MCRF), mates Hirose U.FL, (http://www.molex.com/pdm_docs/sd/734120110_sd.pdf)

Pads: 2
SMD: 5.0×5.0
Boards: 137

C_Disc_D6.0mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=6*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 7.1×3.0
Boards: 136

JST_EH_B3B-EH-A_1x03_P2.50mm_Vertical

FP3D

Connector_JST

JST EH series connector, B3B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf)

Pads: 3
THT: 11.0×4.8
Boards: 136

USB_C_Receptacle_GCT_USB4085

FP3D

Connector_USB

USB 2.0 Type C Receptacle, https://gct.co/Files/Drawings/USB4085.pdf

Pads: 17
THT: 10.6×10.2
Boards: 136

Oscillator_SMD_Abracon_ASE-4Pin_3.2x2.5mm

FP—

Oscillator

Abracon ASE, Miniature Crystal Clock Oscillator, 3.2x2.5mm package, SMD, http://www.abracon.com/Oscillators/ASEseries.pdf

Pads: 4
SMD: 4.2×3.5
Boards: 136

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136