Footprints
1,509 footprints matching “2mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 7
RF_Attenuator_Susumu_PAT1220
RF_Converter
http://www.susumu-usa.com/pdf/Foot_Print_38.pdf, https://www.susumu.co.jp/common/pdf/n_catalog_partition16_en.pdf
- Pads
- 3
- SMD
- 2.8×2.4
- Boards
- 7
TerminalBlock_MetzConnect_Type059_RT06303HBWC_1x03_P3.50mm_Horizontal
TerminalBlock_MetzConnect
terminal block Metz Connect Type059_RT06303HBWC, 3 pins, pitch 3.5mm, size 10.5x6.5mm, drill diameter 1.2mm, pad diameter 2.3mm, https://www.metz-connect.com/externalfiles/310591/863246.PDF
- Pads
- 3
- THT
- 11.5×7.5
- Boards
- 7
SW_DIP_SPSTx01_Slide_9.78x4.72mm_W8.61mm_P2.54mm
Button_Switch_SMD
SMD 1x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x4.72mm (see e.g. https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD
- Pads
- 2
- SMD
- 11.6×5.3
- Boards
- 6
SW_DIP_SPSTx01_Piano_10.8x4.1mm_W7.62mm_P2.54mm
Button_Switch_THT
1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm
- Pads
- 2
- THT
- 13.1×4.7
- Boards
- 6
SW_DIP_SPSTx05_Slide_6.7x14.26mm_W7.62mm_P2.54mm_LowProfile
Button_Switch_THT
5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile
- Pads
- 10
- THT
- 9.7×14.9
- Boards
- 6
C_Rect_L9.0mm_W3.2mm_P7.50mm_MKT
Capacitor_THT
C, Rect series, Radial, pin pitch=7.50mm, length*width=9*3.2mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf
- Pads
- 2
- THT
- 9.6×3.7
- Boards
- 6
PhoenixContact_GMSTBVA_2,5_2-G-7,62_1x02_P7.62mm_Vertical
Connector_Phoenix_GMSTB
Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/2-G-7,62; number of pins: 02; pin pitch: 7.62mm; Vertical || order number: 1766770 12A 630V
- Pads
- 2
- THT
- 16.3×9.6
- Boards
- 6
SolderWire-2sqmm_1x04_P7.8mm_D2mm_OD3.9mm
Connector_Wire
Soldered wire connection, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 28.8×4.9
- Boards
- 6
D_T-1_P12.70mm_Horizontal
Diode_THT
Diode, T-1 series, Axial, Horizontal, pin pitch=12.7mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf
- Pads
- 2
- THT
- 15.2×3.1
- Boards
- 6
Oscillator_SeikoEpson_SG-8002DC
Oscillator
8-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 4
- THT
- 9.8×14.0
- Boards
- 6
DFN-10-1EP_2.6x2.6mm_P0.5mm_EP1.3x2.2mm
Package_DFN_QFN
DFN, 10 Pin (https://www.nxp.com/docs/en/data-sheet/PCF85063A.pdf#page=48)
- Pads
- 11
- SMD
- 3.9×3.1
- Boards
- 6
QFN-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20)
- Pads
- 49
- SMD
- 7.3×7.3
- Boards
- 6
DIP-4_W7.62mm_Socket
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 4
- THT
- 10.7×5.7
- Boards
- 6
DIP-6_W7.62mm_SMDSocket_SmallPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 6
- SMD
- 10.7×8.2
- Boards
- 6
SMDIP-8_W7.62mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 8
- SMD
- 10.1×10.7
- Boards
- 6
Kionix_LGA-12_2x2mm_P0.5mm_LayoutBorder2x4y
Package_LGA
Kionix LGA, 12 Pin (https://www.digikey.com/Site/Global/Layouts/DownloadPdf.ashx?pdfUrl=3557DE8B1578472CBA17FB72BE0052DC#page=4)
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- 6
ST_MultiPowerSO-30
Package_SO
MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf)
- Pads
- 33
- SMD
- 20.1×17.7
- Boards
- 6
Texas_DQK
Package_SON
Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf
- Pads
- 8
- SMD
- 2.9×2.5
- Boards
- 6
WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 6
R_Axial_DIN0516_L15.5mm_D5.0mm_P7.62mm_Vertical
Resistor_THT
Resistor, Axial_DIN0516 series, Axial, Vertical, pin pitch=7.62mm, 2W, length*diameter=15.5*5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 11.8×5.5
- Boards
- 6
OSHW-Symbol_13.4x12mm_Copper
Symbol
Open Source Hardware Symbol
- Pads
- —
- Mount
- exclude_from_pos_files
- Boards
- 6
TerminalBlock_MetzConnect_Type059_RT06302HBWC_1x02_P3.50mm_Horizontal
TerminalBlock_MetzConnect
terminal block Metz Connect Type059_RT06302HBWC, 2 pins, pitch 3.5mm, size 7x6.5mm, drill diameter 1.2mm, pad diameter 2.3mm, https://www.metz-connect.com/externalfiles/310591/863246.PDF
- Pads
- 2
- THT
- 8.0×7.5
- Boards
- 6
TerminalBlock_MetzConnect_Type703_RT10N02HGLU_1x02_P9.52mm_Horizontal
TerminalBlock_MetzConnect
terminal block Metz Connect Type703_RT10N02HGLU, 2 pins, pitch 9.52mm, size 19x12.5mm, drill diameter 1.3mm, pad diameter 2.6mm, https://www.metz-connect.com/externalfiles/317031/863835.PDF
- Pads
- 2
- THT
- 20.0×13.5
- Boards
- 6