Footprints
3,489 footprints matching “2x”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-200_10x14.5mm_Layout12x22_P0.8x0.65mm
Package_BGA
BGA-200, 10.0x14.5mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf
- Pads
- 200
- SMD
- 12.0×16.5
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
EPC_BGA-4_0.9x0.9mm_Layout2x2_P0.45mm
Package_BGA
EPC BGA-4, 0.9x09mm, Pitch 0.4mm, https://epc-co.com/epc/Portals/0/epc/documents/datasheets/EPC2035_datasheet.pdf
- Pads
- 4
- SMD
- 1.2×1.2
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
Lattice_caBGA-756_27x27mm_Layout32x32_P0.8mm
Package_BGA
Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213
- Pads
- 756
- SMD
- 29.0×29.0
- Boards
- —
LFBGA-169_12x16mm_Layout14x28_P0.5mm
Package_BGA
JEDEC eMMC AA BGA-169, 12.0x16.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 169
- SMD
- 14.0×18.0
- Boards
- —
LFBGA-169_12x18mm_Layout14x28_P0.5mm
Package_BGA
JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 169
- SMD
- 14.0×20.0
- Boards
- —
LFBGA-484_18x18mm_Layout22x22_P0.8mm
Package_BGA
LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 484
- SMD
- 20.0×20.0
- Boards
- —
Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm
Package_BGA
Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf
- Pads
- 134
- SMD
- 17.0×17.0
- Boards
- —
Microchip_FCVG484_BGA-484_19x19mm_Layout22x22_P0.8mm
Package_BGA
FCVG484, 19.0x19.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
ST_LFBGA-448_18x18mm_Layout22x22_P0.8mm
Package_BGA
ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf
- Pads
- 448
- SMD
- 20.0×20.0
- Boards
- —
ST_TFBGA-361_12x12mm_Layout23x23_P0.5mmP0.65mm
Package_BGA
ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf
- Pads
- 361
- SMD
- 14.0×14.0
- Boards
- —
ST_TFBGA-436_18x18mm_Layout22x22_P0.8mm
Package_BGA
ST TFBGA-436, 18.0x18.0mm, 436 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=222
- Pads
- 436
- SMD
- 20.0×20.0
- Boards
- —
Texas_DSBGA-5_0.8875x1.3875mm_Layout2x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf
- Pads
- 5
- SMD
- 2.9×3.4
- Boards
- —
Texas_DSBGA-6_0.704x1.054mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA0006-C01 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62800.pdf
- Pads
- 6
- SMD
- 2.7×3.1
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
Texas_DSBGA-6_0.76x1.16mm_Layout2x3_P0.4mm
Package_BGA
Texas Instruments YFP0006, DSBGA-6, 0.76x1.16mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/ts5a12301e.pdf#page=23
- Pads
- 6
- SMD
- 2.8×3.2
- Boards
- —
Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelB
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf
- Pads
- 6
- SMD
- 2.9×3.3
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
Texas_PicoStar_BGA-4_0.758x0.758mm_Layout2x2_P0.4mm
Package_BGA
Texas Instruments PicoStar - 0.15 mm max height, 0.758x0.758mm, 4 Ball, 2x2 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/tmp114.pdf
- Pads
- 4
- SMD
- 2.8×2.8
- Boards
- —
TFBGA-324_12x12mm_Layout18x18_P0.65mm
Package_BGA
TFBGA-324, NSMD, 12.0x12.0mm, 324 Ball, 18x18 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 324
- SMD
- 14.0×14.0
- Boards
- —
UFBGA-100_7x7mm_Layout12x12_P0.5mm
Package_BGA
UFBGA-100, 7.0x7.0mm, 100 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=93
- Pads
- 100
- SMD
- 9.0×9.0
- Boards
- —
UFBGA-132_7x7mm_Layout12x12_P0.5mm
Package_BGA
UFBGA-132, 7.0x7.0mm, 132 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32l152zc.pdf#page=123
- Pads
- 132
- SMD
- 9.0×9.0
- Boards
- —
