Footprints
3,487 footprints matching “4mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SolderWire-1sqmm_1x01_D1.4mm_OD2.7mm
Connector_Wire
Soldered wire connection, for a single 1 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 1.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 4.2×3.8
- Boards
- 18
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 18
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 18
DIP-32_W15.24mm_Socket_LongPads
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 32
- THT
- 18.3×41.3
- Boards
- 18
SMDIP-4_W9.53mm_Clearance8mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 4
- SMD
- 11.5×5.6
- Boards
- 18
TQFP-64_14x14mm_P0.8mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)
- Pads
- 64
- SMD
- 17.3×17.3
- Boards
- 18
Pin_D0.9mm_L10.0mm_W2.4mm_FlatFork
Connector_Pin
solder Pin_ with flat fork, hole diameter 0.9mm, length 10.0mm, width 2.4mm
- Pads
- 1
- THT
- 3.4×2.8
- Boards
- 17
PinHeader_1x05_P2.54mm_Vertical_SMD_Pin1Left
Connector_PinHeader_2.54mm
surface-mounted straight pin header, 1x05, 2.54mm pitch, single row, style 1 (pin 1 left)
- Pads
- 5
- SMD
- 6.8×13.7
- Boards
- 17
PinSocket_2x32_P2.54mm_Vertical
Connector_PinSocket_2.54mm
Through hole straight socket strip, 2x32, 2.54mm pitch, double rows (from Kicad 4.0.7), script generated
- Pads
- 64
- THT
- 6.1×82.3
- Boards
- 17
QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- 17
DIP-24_W15.24mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 24
- THT
- 18.1×31.0
- Boards
- 17
DIP-6_W7.62mm_Socket
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 6
- THT
- 10.7×8.2
- Boards
- 17
DIP-8_W10.16mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 8
- THT
- 12.3×10.7
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
PinHeader_1x21_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x21, 2.54mm pitch, single row
- Pads
- 21
- THT
- 3.5×54.4
- Boards
- 16
PinHeader_1x28_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x28, 2.54mm pitch, single row
- Pads
- 28
- THT
- 3.5×72.1
- Boards
- 16
PinHeader_1x32_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x32, 2.54mm pitch, single row
- Pads
- 32
- THT
- 3.5×82.3
- Boards
- 16
PinHeader_2x01_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 2x01, 2.54mm pitch, 6mm pin length, double rows
- Pads
- 2
- THT
- 14.9×3.5
- Boards
- 16
PinHeader_2x16_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 2x16, 2.54mm pitch, 6mm pin length, double rows
- Pads
- 32
- THT
- 14.9×41.6
- Boards
- 16
PinHeader_2x22_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 2x22, 2.54mm pitch, double rows
- Pads
- 44
- THT
- 6.1×56.9
- Boards
- 16
QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 16
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16
DIP-24_W7.62mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 24
- THT
- 10.5×31.0
- Boards
- 16
SMDIP-6_W7.62mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 6
- SMD
- 10.1×8.1
- Boards
- 16