Footprints
2,236 footprints matching “54”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-32_W7.62mm
Package_DIP
32-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 32
- THT
- 9.8×41.3
- Boards
- 12
DIP-48_W15.24mm
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 48
- THT
- 17.3×61.5
- Boards
- 12
TerminalBlock_Xinya_XY308-2.54-3P_1x03_P2.54mm_Horizontal
TerminalBlock
Terminal Block Xinya XY308-2.54-3P, 3 pins, pitch 2.54mm, size 8.12x6.5mm, drill diameter 1.2mm, pad diameter 2mm, http://www.xinyaelectronic.com/product/xy308-254
- Pads
- 3
- THT
- 9.1×7.5
- Boards
- 12
SW_DIP_SPSTx05_Slide_9.78x14.88mm_W7.62mm_P2.54mm
Button_Switch_THT
5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. https://www.ctscorp.com/wp-content/uploads/206-208.pdf)
- Pads
- 10
- THT
- 10.3×15.5
- Boards
- 11
SW_DIP_SPSTx08_Slide_6.7x21.88mm_W7.62mm_P2.54mm_LowProfile
Button_Switch_THT
8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile
- Pads
- 16
- THT
- 9.7×22.5
- Boards
- 11
IDC-Header_2x04_P2.54mm_Horizontal
Connector_IDC
Through hole IDC box header, 2x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0
- Pads
- 8
- THT
- 15.1×18.8
- Boards
- 11
IDC-Header_2x07_P2.54mm_Horizontal
Connector_IDC
Through hole IDC box header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0
- Pads
- 14
- THT
- 15.1×26.4
- Boards
- 11
IDC-Header_2x13_P2.54mm_Horizontal
Connector_IDC
Through hole IDC box header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0
- Pads
- 26
- THT
- 15.1×41.7
- Boards
- 11
Molex_KK-254_AE-6410-10A_1x10_P2.54mm_Vertical
Connector_Molex
Molex KK-254 Interconnect System, old/engineering part number: AE-6410-10A example for new part number: 22-27-2101, 10 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf)
- Pads
- 10
- THT
- 26.4×6.8
- Boards
- 11
PinHeader_1x26_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x26, 2.54mm pitch, single row
- Pads
- 26
- THT
- 3.5×67.0
- Boards
- 11
PinSocket_2x05_P2.54mm_Horizontal
Connector_PinSocket_2.54mm
Through hole angled socket strip, 2x05, 2.54mm pitch, 8.51mm socket length, double rows (from Kicad 4.0.7), script generated
- Pads
- 10
- THT
- 14.8×13.7
- Boards
- 11
PinSocket_2x15_P2.54mm_Horizontal
Connector_PinSocket_2.54mm
Through hole angled socket strip, 2x15, 2.54mm pitch, 8.51mm socket length, double rows (from Kicad 4.0.7), script generated
- Pads
- 30
- THT
- 14.8×39.1
- Boards
- 11
USB_Micro-B_XKB_U254-051T-4BH83-F1S
Connector_USB
XKB Connectivity, USB Micro-B, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2206091745_XKB-Connectivity-U254-051T-4BH83-F1S_C397452.pdf
- Pads
- 6
- SMD
- 9.3×6.5
- Boards
- 11
DIP-14_W10.16mm
Package_DIP
14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 14
- THT
- 12.3×18.3
- Boards
- 11
DIP-16_W10.16mm_LongPads
Package_DIP
16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 16
- THT
- 13.1×20.8
- Boards
- 11
Mini-Circuits_CD542_H2.84mm
RF_Mini-Circuits
https://ww2.minicircuits.com/case_style/CD542.pdf
- Pads
- 6
- SMD
- 8.1×8.6
- Boards
- 11
Mini-Circuits_CD542_LandPatternPL-052
RF_Mini-Circuits
Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf)
- Pads
- 6
- SMD
- 9.9×8.4
- Boards
- 11
TerminalBlock_Phoenix_MPT-0,5-8-2.54_1x08_P2.54mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MPT-0,5-8-2.54, 8 pins, pitch 2.54mm, size 20.8x6.2mm, drill diameter 1.1mm, pad diameter 2.2mm, http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf
- Pads
- 8
- THT
- 21.8×7.2
- Boards
- 11
SW_DIP_SPSTx02_Slide_9.78x7.26mm_W8.61mm_P2.54mm
Button_Switch_SMD
SMD 2x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x7.26mm (see e.g. https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD
- Pads
- 4
- SMD
- 11.6×7.9
- Boards
- 10
IDC-Header_2x03_P2.54mm_Vertical_SMD
Connector_IDC
SMD IDC box header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf
- Pads
- 6
- SMD
- 13.6×16.3
- Boards
- 10
IDC-Header_2x25_P2.54mm_Vertical
Connector_IDC
Through hole IDC box header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0
- Pads
- 50
- THT
- 9.9×72.2
- Boards
- 10
Molex_SL_171971-0002_1x02_P2.54mm_Vertical
Connector_Molex
Molex Stackable Linear Connector, 171971-0002 (compatible alternatives: 171971-0102, 171971-0202), 2 Pins per row (https://www.molex.com/pdm_docs/sd/1719710002_sd.pdf)
- Pads
- 2
- THT
- 8.4×7.6
- Boards
- 10
PinHeader_1x03_P2.54mm_Vertical_SMD_Pin1Right
Connector_PinHeader_2.54mm
surface-mounted straight pin header, 1x03, 2.54mm pitch, single row, style 2 (pin 1 right)
- Pads
- 3
- SMD
- 6.8×8.6
- Boards
- 10
PinHeader_1x06_P2.54mm_Vertical_SMD_Pin1Right
Connector_PinHeader_2.54mm
surface-mounted straight pin header, 1x06, 2.54mm pitch, single row, style 2 (pin 1 right)
- Pads
- 6
- SMD
- 6.8×16.2
- Boards
- 10