Footprints
359 footprints matching “7.62mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
CERDIP-28_W7.62mm_SideBrazed_Socket
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- —
DIP-10_W7.62mm_SMDSocket_SmallPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 10
- SMD
- 10.7×13.3
- Boards
- —
DIP-10_W7.62mm_Socket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 10
- THT
- 10.7×13.3
- Boards
- —
DIP-18_W7.62mm_SMDSocket_SmallPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 18
- SMD
- 10.7×23.5
- Boards
- —
DIP-20_W7.62mm_SMDSocket_SmallPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 20
- SMD
- 10.7×26.0
- Boards
- —
DIP-22_W7.62mm
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 22
- THT
- 9.7×28.4
- Boards
- —
DIP-22_W7.62mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 22
- THT
- 10.5×28.4
- Boards
- —
DIP-22_W7.62mm_SMDSocket_SmallPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 22
- SMD
- 10.7×28.6
- Boards
- —
DIP-22_W7.62mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
DIP-24_W7.62mm_SMDSocket_SmallPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 24
- SMD
- 10.7×31.1
- Boards
- —
DIP-5-6_W7.62mm_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads
- Pads
- 5
- THT
- 10.6×8.2
- Boards
- —
DIP-5-6_W7.62mm_SMDSocket_SmallPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads
- Pads
- 5
- SMD
- 10.7×8.3
- Boards
- —
DIP-5-6_W7.62mm_Socket
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket
- Pads
- 5
- THT
- 10.7×8.3
- Boards
- —
DIP-5-6_W7.62mm_Socket_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads
- Pads
- 5
- THT
- 10.7×8.3
- Boards
- —
DIP-8-16_W7.62mm_Socket
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 8
- THT
- 10.7×25.9
- Boards
- —
DIP-8-16_W7.62mm_Socket_LongPads
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 8
- THT
- 10.7×25.9
- Boards
- —
DIP-8-N6_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- —
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
SMDIP-10_W7.62mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 10
- SMD
- 10.1×13.2
- Boards
- —
SMDIP-12_W7.62mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 12
- SMD
- 10.1×15.7
- Boards
- —