Footprints
1,225 footprints matching “6mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Molex_KK-396_5273-04A_1x04_P3.96mm_Vertical
Connector_Molex
Molex KK 396 Interconnect System, old/engineering part number: 5273-04A example for new part number: 09-65-2048, 4 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf)
- Pads
- 4
- THT
- 16.1×11.8
- Boards
- 3
Molex_KK-396_5273-05A_1x05_P3.96mm_Vertical
Connector_Molex
Molex KK 396 Interconnect System, old/engineering part number: 5273-05A example for new part number: 09-65-2058, 5 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf)
- Pads
- 5
- THT
- 20.0×11.8
- Boards
- 3
PinHeader_1x26_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 1x26, 2.54mm pitch, 6mm pin length, single row
- Pads
- 26
- THT
- 12.3×67.0
- Boards
- 3
PinHeader_1x36_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 1x36, 2.54mm pitch, 6mm pin length, single row
- Pads
- 36
- THT
- 12.3×92.4
- Boards
- 3
PinHeader_2x11_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 2x11, 2.54mm pitch, 6mm pin length, double rows
- Pads
- 22
- THT
- 14.9×28.9
- Boards
- 3
TE_826576-2_1x02_P3.96mm_Vertical
Connector_TE-Connectivity
TE, 826576-2, 2 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English)
- Pads
- 2
- THT
- 8.3×7.4
- Boards
- 3
SolderWire-1.5sqmm_1x03_P6mm_D1.7mm_OD3mm
Connector_Wire
Soldered wire connection, for 3 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 3
- THT
- 16.5×4.2
- Boards
- 3
SolderWire-1.5sqmm_1x04_P6mm_D1.7mm_OD3mm
Connector_Wire
Soldered wire connection, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 22.5×4.2
- Boards
- 3
Fuseholder_Clip-5x20mm_Eaton_1A5601-01_Inline_P20.80x6.76mm_D1.70mm_Horizontal
Fuse
Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Eaton 1A5601-01, https://www.eaton.com/content/dam/eaton/products/electronic-components/resources/data-sheet/eaton-1axxxx-pcb-fuse-clips-atc-atm-blade-data-sheet.pdf
- Pads
- 2
- THT
- 24.0×6.9
- Boards
- 3
DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 13
- SMD
- 4.3×3.6
- Boards
- 3
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)
- Pads
- 9
- SMD
- 3.3×2.5
- Boards
- 3
HVQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
MLF-6-1EP_1.6x1.6mm_P0.5mm_EP0.5x1.26mm
Package_DFN_QFN
MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf)
- Pads
- 7
- SMD
- 2.8×2.1
- Boards
- 3
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.6mm
Package_DFN_QFN
QFN, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm_ThermalVias
Package_DFN_QFN
QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 3
TQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
TQFN, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF)
- Pads
- 25
- SMD
- 4.7×4.7
- Boards
- 3
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 3
WQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/lm26480.pdf#page=39)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
DIP-12_W10.16mm
Package_DIP
12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 12
- THT
- 12.3×15.7
- Boards
- 3
DIP-4_W10.16mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 4
- THT
- 13.1×5.6
- Boards
- 3
LGA-8_8x6mm_P1.27mm
Package_LGA
LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6)
- Pads
- 8
- SMD
- 9.2×6.5
- Boards
- 3
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
SIPAK_Vertical
Package_TO_SOT_THT
SIPAK, Vertical, RM 2.286mm
- Pads
- 3
- THT
- 7.1×2.8
- Boards
- 3