Footprints

497 footprints matching “SOP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

497 footprints · page 17 of 21

Matched by name and keywords. Search by meaning instead

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads
39
SMD
9.5×13.0
Boards
—

HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias

FP3D

Package_SO

HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)

Pads
39
SMD
9.5×13.0
Boards
—

HTSSOP-44_6.1x14mm_P0.635mm_TopEP4.14x7.01mm

FP—

Package_SO

HTSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38)

Pads
44
SMD
9.5×14.5
Boards
—

HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm

FP—

Package_SO

HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf)

Pads
11
SMD
6.3×3.5
Boards
—

HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm_ThermalVias

FP—

Package_SO

HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf)

Pads
11
SMD
6.3×3.5
Boards
—

JEITA_SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)

Pads
16
SMD
7.7×10.4
Boards
—

Linear_HTSSOP-31-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

Linear HTSSOP, 31 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads
32
SMD
7.1×10.2
Boards
—

Linear_HTSSOP-31-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

Linear HTSSOP, 31 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads
32
SMD
7.1×10.2
Boards
—

MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm_ThermalVias

FP—

Package_SO

MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)

Pads
11
SMD
6.3×3.5
Boards
—

MSOP-10-1EP_3x3mm_P0.5mm_EP2.2x3.1mm_Mask1.83x1.89mm

FP—

Package_SO

MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27)

Pads
11
SMD
6.3×3.6
Boards
—

MSOP-10-1EP_3x3mm_P0.5mm_EP2.2x3.1mm_Mask1.83x1.89mm_ThermalVias

FP—

Package_SO

MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27)

Pads
11
SMD
6.3×3.6
Boards
—

MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads
13
SMD
6.3×4.5
Boards
—

MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)

Pads
9
SMD
6.3×3.5
Boards
—

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads
29
SMD
8.0×10.3
Boards
—

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads
29
SMD
8.0×10.3
Boards
—

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
12
SMD
13.6×11.2
Boards
—

PSOP-44_16.9x27.17mm_P1.27mm

FP3D

Package_SO

PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm

Pads
44
SMD
19.2×28.8
Boards
—