Footprints

4,308 footprints matching “row”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

4,308 footprints · page 174 of 180

Matched by name and keywords. Search by meaning instead

Microchip_DRQFN-44-1EP_5x5mm_P0.7mm_EP2.65x2.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 44 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf)

Pads: 45
SMD: 6.0×6.0
Boards: —

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm

FP—

Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads: 65
SMD: 8.1×8.1
Boards: —

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm_ThermalVias

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Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads: 65
SMD: 8.1×8.1
Boards: —

Texas_S-PWQFN-N100_EP5.5x5.5mm

FP—

Package_DFN_QFN

http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=szza059&fileType=pdf,http://www.ti.com/lit/ds/sllse76m/sllse76m.pdf

Pads: 105
SMD: 9.9×9.9
Boards: —

Texas_WQFN-MR-100_3x3-DapStencil

FP3D

Package_DFN_QFN

http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=szza059&fileType=pdf,http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=mpqf258&fileType=pdf,http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=LPPD235&fileType=pdf

Pads: 105
SMD: 10.5×10.5
Boards: —

Texas_WQFN-MR-100_ThermalVias_3x3-DapStencil

FP3D

Package_DFN_QFN

Pads: 105
SMD: 10.5×10.5
Boards: —

CERDIP-14_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.7×19.7
Boards: —

CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.7×20.9
Boards: —

CERDIP-18_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 10.5×23.4
Boards: —

CERDIP-18_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 10.7×23.5
Boards: —

CERDIP-18_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 10.7×23.5
Boards: —

CERDIP-20_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.7×26.0
Boards: —

CERDIP-22_W7.62mm_SideBrazed

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 22
THT: 9.7×28.4
Boards: —

CERDIP-22_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 22
THT: 10.5×28.4
Boards: —

CERDIP-22_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 22
THT: 10.7×28.6
Boards: —

CERDIP-22_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 22
THT: 10.7×28.6
Boards: —

CERDIP-24_W7.62mm_SideBrazed

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 24
THT: 9.7×31.0
Boards: —

CERDIP-24_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 24
THT: 10.5×31.0
Boards: —

CERDIP-24_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 24
THT: 10.7×31.1
Boards: —

CERDIP-24_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 24
THT: 10.7×31.1
Boards: —

CERDIP-28_W7.62mm_SideBrazed

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 9.7×36.1
Boards: —

CERDIP-28_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 10.5×36.1
Boards: —

CERDIP-28_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 10.7×36.2
Boards: —

DIP-10_W10.16mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 10
THT: 12.3×13.2
Boards: —