Footprints

514 footprints matching “vias”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

514 footprints · page 18 of 22

Matched by name and keywords. Search by meaning instead

VQFN-16-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

VQFN-20-1EP_3x3mm_P0.45mm_EP1.55x1.55mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=264)

Pads: 21
SMD: 4.3×4.3
Boards: —

VQFN-28-1EP_4x5mm_P0.5mm_EP2.55x3.55mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (http://www.ti.com/lit/ds/symlink/lm5175.pdf#page=40)

Pads: 29
SMD: 5.3×6.3
Boards: —

VQFN-28-1EP_5x5mm_P0.5mm_EP3.25x3.25mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/APID/ProductDocuments/DataSheets/MCP251863-External-CAN-FD-Controller-with-Integrated-Transceiver-DS20006624.pdf#page=101)

Pads: 29
SMD: 6.2×6.2
Boards: —

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads: 29
SMD: 6.2×6.2
Boards: —

VQFN-32-1EP_4x4mm_P0.4mm_EP2.8x2.8mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/tps25750.pdf#page=78)

Pads: 33
SMD: 5.3×5.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.3x3.3mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://tridentiot.com/wp-content/uploads/2024/11/DS-ZW-0001-01-T32CZ20-Datasheet.pdf#page=36)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.5x3.5mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP6536/document_id/3761/)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 40 Pin (JEDEC MO-220-K.01, variation VHHE-1, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-46-1EP_5x6mm_P0.4mm_EP2.8x3.8mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 46 Pin (http://www.ti.com/lit/ds/symlink/lp5036.pdf#page=59)

Pads: 47
SMD: 6.3×7.3
Boards: —

VQFN-48-1EP_6x6mm_P0.4mm_EP4.1x4.1mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf)

Pads: 49
SMD: 7.2×7.2
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from STMicroeletronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.st.com/resource/en/datasheet/stspin32f0a.pdf#page=37)

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: —