Footprints

512 footprints matching “SO-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

512 footprints · page 19 of 22

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TDFN-8-1EP_3x2mm_P0.5mm_EP1.4x1.4mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35)

Pads: 9
SMD: 4.2×2.5
Boards: —

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: —

Texas_UQFN-8_1.5x1.5mm_P0.5mm

FP3D

Package_DFN_QFN

Texas UQFN, 8 Pin (https://www.ti.com/lit/ml/mpqf207e/mpqf207e.pdf)

Pads: 8
SMD: 2.7×2.8
Boards: —

WDFN-8_2x2mm_P0.5mm

FP—

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)

Pads: 8
SMD: 2.8×2.5
Boards: —

WDFN-8-1EP_2x2.2mm_P0.5mm_EP0.80x0.54

FP—

Package_DFN_QFN

https://www.onsemi.com/pub/Collateral/511BN.PDF

Pads: 9
SMD: 2.5×2.7
Boards: —

WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias

FP3D

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads: 9
SMD: 5.2×3.5
Boards: —

WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads: 9
SMD: 9.2×6.5
Boards: —

WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads: 9
SMD: 9.2×6.5
Boards: —

WFDFPN-8-1EP_3x2mm_P0.5mm_EP1.25x1.35mm

FP—

Package_DFN_QFN

WFDFPN, 8 Pin (https://www.st.com/resource/en/datasheet/m95512-r.pdf#page=34)

Pads: 9
SMD: 4.3×2.5
Boards: —

DIP-8-16_W7.62mm_Socket

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-16_W7.62mm_Socket_LongPads

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads: 7
THT: 9.8×10.7
Boards: —

Fairchild_LSOP-8

FP—

Package_DIP

8-lead, 300 mils wide, surface mount package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf)

Pads: 8
SMD: 11.2×10.2
Boards: —

IXYS_Flatpak-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 10.8×10.2
Boards: —

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 11.1×10.2
Boards: —