Footprints
422 footprints matching “0.8mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Xilinx_CSG324
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 3
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- 3
PQFP-80_14x20mm_P0.8mm
Package_QFP
PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 80
- SMD
- 18.5×24.5
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
HVSON-8-1EP_4x4mm_P0.8mm_EP2.2x3.1mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf (page 57))
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 3
WSON-8-1EP_4x4mm_P0.8mm_EP2.2x3mm
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26)
- Pads
- 9
- SMD
- 4.5×4.5
- Boards
- 3
LED_LiteOn_LTST-C295K_1.6x0.8mm
LED_SMD
Topview dual http://optoelectronics.liteon.com/upload/download/DS22-2009-0072/LTST-C295KGKRKT.PDF
- Pads
- 4
- SMD
- 2.1×1.5
- Boards
- 2
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
Micron_FBGA-96_7.5x13.5mm_Layout9x16_P0.8mm
Package_BGA
FBGA-96, 7.5x13.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27
- Pads
- 96
- SMD
- 9.5×15.5
- Boards
- 2
Xilinx_CLG400
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 17x17mm, 400 Ball, 20x20 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78
- Pads
- 400
- SMD
- 19.0×19.0
- Boards
- 2
Xilinx_CSG325
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
DFN-8-1EP_4x4mm_P0.8mm_EP2.3x3.24mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/ld1086.pdf#page=35)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 2
Texas_X2SON-5_0.8x0.8mm_P0.48mm
Package_SON
X2SON 5 pin 0.8x0.8mm package (Reference Datasheet: https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=39 Reference part: SN74LVC1G17) [StepUp generated footprint]
- Pads
- 5
- SMD
- 1.8×1.3
- Boards
- 2
WSON-8-1EP_4x4mm_P0.8mm_EP2.6x3mm
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf#page=43)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 2
Samtec_HSEC8-109-X-X-DV_2x09_P0.8mm_Edge
Connector_Samtec_HSEC8
Highspeed card edge for PCB's with 2x9 contacts
- Pads
- 18
- Mount
- 12.2×6.9
- Boards
- 1
L_CommonMode_Toroid_Vertical_L19.3mm_W10.8mm_Px6.35mm_Py15.24mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=6.35*15.24mm^2, length*width=19.304*10.795mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 19.8×11.3
- Boards
- 1
R_LDR_12x10.8mm_P9.0mm_Vertical
OptoDevice
Resistor, LDR 12x10.8mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf
- Pads
- 2
- THT
- 12.6×11.3
- Boards
- 1
Alliance_TFBGA-54_8x8mm_Layout9x9_P0.8mm
Package_BGA
Alliance TFBGA 54 pins, 8x8mm, 54 Ball, 9x9 Layout, 0.8mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/dram/Alliance_Memory_64M-AS4C4M16SA-CI_v5.0_October_2018.pdf#page=54
- Pads
- 54
- SMD
- 10.0×10.0
- Boards
- 1
BGA-529_19x19mm_Layout23x23_P0.8mm
Package_BGA
BGA-529, NSMD, 19.0x19.0mm, 529 Ball, 23x23 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 529
- SMD
- 21.0×21.0
- Boards
- 1
Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm
Package_BGA
Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213
- Pads
- 381
- SMD
- 19.0×19.0
- Boards
- 1
LFBGA-100_10x10mm_Layout10x10_P0.8mm
Package_BGA
LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87
- Pads
- 100
- SMD
- 12.0×12.0
- Boards
- 1
LFBGA-144_10x10mm_Layout12x12_P0.8mm
Package_BGA
LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114
- Pads
- 144
- SMD
- 12.0×12.0
- Boards
- 1
Micron_FBGA-96_8x14mm_Layout9x16_P0.8mm
Package_BGA
FBGA-96, 8.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28
- Pads
- 96
- SMD
- 10.0×16.0
- Boards
- 1