Footprints

31 footprints matching “16.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

31 footprints · page 2 of 2

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CAP ALSMD ELEC 17MM H16.5MM

FP—

celestial-altium-Capacitor_Aluminium

Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 16.50mm Height, 19.00mm Maximum Leads Span

Pads: 2
SMD: 23.6×17.4
Boards: —

CAP ALSMD ELEC 19MM H16.5MM CAPD18MM

FP—

celestial-altium-Capacitor_Aluminium

Aluminum SMD Electrolytic Capacitor, 19.00mm Land Size, 18.00mm Diameter, 16.50mm Height, 21.00mm Maximum Leads Span

Pads: 2
SMD: 26.2×19.4
Boards: —

GSM_Module_17.8x16.5mm_A2235-H

FP—

digikey-digikey-footprints

Pads: 23
SMD: 18.0×18.3
Boards: —

GSM_Module_17.8x16.5mm_A2235-H

FP—

digikey-Source_Footprints

Pads: 23
SMD: 18.0×18.3
Boards: —

TFBGA-68_10x16.5mm_Layout9x19_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 68 balls (JEDEC MO-210Q), 16.5x10.0mm, 68 Ball, 9x19 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 68
SMD: 12.0×18.5
Boards: —

TFBGA-84_10x16.5mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 16.5x10.0mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 12.0×18.5
Boards: —

L_Toroid_Horizontal_D32.5mm_P28.90mm_Bourns_2300

FP—

Inductor_THT

L_Toroid, Horizontal series, Radial, pin pitch=28.90mm, diameter=32.5mm, height=16.5mm, Bourns, 2300, http://www.bourns.com/docs/Product-Datasheets/2300_series.pdf?sfvrsn=3

Pads: 2
THT: 33.0×33.0
Boards: —