Footprints

175 footprints matching “16mm

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

175 footprints · page 2 of 8

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DIP-4_W10.16mm

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
4
THT
12.3×5.6
Boards
9

SOP-28_8.4x18.16mm_P1.27mm

FP3D

Package_SO

SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)

Pads
28
SMD
13.9×18.7
Boards
8

L_Toroid_Vertical_L26.7mm_W14.0mm_P10.16mm_Pulse_D

FP

Inductor_THT

L_Toroid, Vertical series, Radial, pin pitch=10.16mm, length*width=26.67*13.97mm^2, Pulse, D, http://datasheet.octopart.com/PE-92112KNL-Pulse-datasheet-17853305.pdf

Pads
2
THT
27.2×14.5
Boards
7

DIP-6_W10.16mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
6
THT
12.3×8.1
Boards
6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
8
THT
13.1×10.7
Boards
6

L_Radial_D12.0mm_P5.00mm_Fastron_11P

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=5.00mm, diameter=12.0mm, height=16mm, Fastron, 11P, http://cdn-reichelt.de/documents/datenblatt/B400/DS_11P.pdf

Pads
2
THT
12.5×12.5
Boards
5

L_Toroid_Vertical_L16.0mm_W8.0mm_P7.62mm

FP

Inductor_THT

L_Toroid, Vertical series, Radial, pin pitch=7.62mm, length*width=16*8mm^2

Pads
2
THT
16.5×11.1
Boards
5

C_Radial_D16.0mm_H31.5mm_P7.50mm

FP3D

Capacitor_THT

C, Radial series, Radial, pin pitch=7.50mm, diameter=16mm, height=31.5mm, Non-Polar Electrolytic Capacitor

Pads
2
THT
16.5×16.5
Boards
4

R_Axial_Power_L25.0mm_W9.0mm_P10.16mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_Power series, Axial, Vertical, pin pitch=10.16mm, 7W, length*width*height=25*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
16.4×9.5
Boards
4

DIP-12_W10.16mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
12
THT
12.3×15.7
Boards
3

DIP-4_W10.16mm_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
4
THT
13.1×5.6
Boards
3

L_Axial_L16.0mm_D7.5mm_P7.62mm_Vertical_Fastron_XHBCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series

Pads
2
THT
13.0×8.0
Boards
2

DIP-14_W10.16mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
14
THT
13.1×18.3
Boards
2

DIP-24_W10.16mm_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
24
THT
13.1×31.0
Boards
2

C_Rect_L29.0mm_W16.0mm_P27.50mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=27.50mm, length*width=29*16mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
30.4×16.5
Boards
1

CP_Radial_D13.0mm_P2.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=2.50mm, diameter=13mm, height=16mm, Electrolytic Capacitor

Pads
2
THT
13.5×13.5
Boards
1

D_5KP_P10.16mm_Horizontal

FP3D

Diode_THT

Diode, 5KP series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=7.62*9.53mm^2, http://www.diodes.com/_files/packages/8686949.gif

Pads
2
THT
13.5×10.0
Boards
1

L_Axial_L16.0mm_D7.5mm_P5.08mm_Vertical_Fastron_XHBCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series

Pads
2
THT
10.4×8.0
Boards
1

L_Axial_L16.0mm_D9.5mm_P20.32mm_Horizontal_Vishay_IM-10-37

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=20.32mm, length*diameter=16*9.5mm^2, Vishay, IM-10-37, http://www.vishay.com/docs/34030/im10.pdf

Pads
2
THT
22.8×10.0
Boards
1

ST_LFBGA-354_16x16mm_Layout19x19_P0.8mm

FP

Package_BGA

ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf

Pads
354
SMD
18.0×18.0
Boards
1

Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm

FP

Package_BGA

Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads
5
SMD
2.8×3.1
Boards
1

DIP-10_W10.16mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
10
THT
13.1×13.2
Boards
1

DIP-12_W10.16mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads
12
THT
13.1×15.7
Boards
1

DIP-22_W10.16mm

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
22
THT
12.3×28.4
Boards
1