Footprints
257 footprints matching “2.4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ESP32-S2-MINI-1
RF_Module
2.4 GHz Wi-Fi and Bluetooth combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf
- Pads
- 65
- SMD
- 45.4×35.3
- Boards
- 20
ESP32-S3-WROOM-1U
RF_Module
2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf
- Pads
- 41
- SMD
- 19.5×20.1
- Boards
- 20
TerminalBlock_Phoenix_PT-1,5-4-3.5-H_1x04_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-4-3.5-H, 4 pins, pitch 3.5mm, size 14x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 4
- THT
- 15.0×8.6
- Boards
- 20
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 18
ESP32-WROOM-32UE
RF_Module
2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf
- Pads
- 39
- SMD
- 19.5×20.2
- Boards
- 18
Pin_D0.9mm_L10.0mm_W2.4mm_FlatFork
Connector_Pin
solder Pin_ with flat fork, hole diameter 0.9mm, length 10.0mm, width 2.4mm
- Pads
- 1
- THT
- 3.4×2.8
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16
SolderWire-2.5sqmm_1x01_D2.4mm_OD3.6mm
Connector_Wire
Soldered wire connection, for a single 2.5 mm² wire, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 5.1×5.0
- Boards
- 15
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 14
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 14
TerminalBlock_4Ucon_1x03_P3.50mm_Horizontal
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 20193, 3 pins, pitch 3.5mm, size 11.2x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/20193.pdf
- Pads
- 3
- THT
- 12.2×8.0
- Boards
- 14
TerminalBlock_4Ucon_1x04_P3.50mm_Horizontal
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 20001, 4 pins, pitch 3.5mm, size 14.7x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/20001.pdf
- Pads
- 4
- THT
- 15.7×8.0
- Boards
- 14
LED_D1.8mm_W1.8mm_H2.4mm_Horizontal_O1.27mm_Z1.6mm
LED_THT
LED, diameter 1.8mm, size 1.8x2.4mm, horizontal offset 1.27mm, z-position of LED center 1.6mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.0×5.8
- Boards
- 13
VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm
Package_SON
VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 13
Raytac_MDBT50Q
RF_Module
Multiprotocol radio SoC module https://www.raytac.com/download/index.php?index_id=43
- Pads
- 61
- SMD
- 11.5×16.5
- Boards
- 13
SolderWire-2.5sqmm_1x01_D2.4mm_OD4.4mm
Connector_Wire
Soldered wire connection, for a single 2.5 mm² wire, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 5.9×5.4
- Boards
- 12
SolderWire-2.5sqmm_1x02_P7.2mm_D2.4mm_OD3.6mm
Connector_Wire
Soldered wire connection, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 12.3×5.0
- Boards
- 12
ESP32-C3-DevKitM-1
RF_Module
2.4 GHz Wi-Fi and Bluetooth module https://docs.espressif.com/projects/esp-dev-kits/en/latest/esp32c3/esp32-c3-devkitm-1/index.html
- Pads
- 30
- THT
- 25.7×44.7
- Boards
- 12
ESP32-S2-MINI-1U
RF_Module
2.4 GHz Wi-Fi and Bluetooth combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf
- Pads
- 65
- SMD
- 15.9×15.9
- Boards
- 12
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
WQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 11
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 11