Footprints

292 footprints matching “3.9”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

292 footprints · page 2 of 13

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HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 28

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 28

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 25

SSOP-10_3.9x4.9mm_P1.00mm

FP3D

Package_SO

10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)

Pads: 10
SMD: 6.7×5.4
Boards: 25

SSOP-8_3.95x5.21x3.27mm_P1.27mm

FP3D

Package_SO

SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm

Pads: 8
SMD: 7.2×5.7
Boards: 22

JST_VH_B3P-VH-B_1x03_P3.96mm_Vertical

FP—

Connector_JST

JST VH PBT series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads: 3
THT: 12.8×9.5
Boards: 20

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

JST_VH_B3P-VH_1x03_P3.96mm_Vertical

FP—

Connector_JST

JST VH series connector, B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads: 3
THT: 12.8×9.5
Boards: 18

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

SolderWire-1.5sqmm_1x01_D1.7mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for a single 1.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 5.4×4.9
Boards: 15

CP_Elec_4x3.9

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Nichicon, 4.0x3.9mm

Pads: 2
SMD: 6.7×4.8
Boards: 14

JST_VH_B2PS-VH_1x02_P3.96mm_Horizontal

FP—

Connector_JST

JST VH series connector, B2PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads: 2
THT: 8.9×17.3
Boards: 14

Molex_KK-396_5273-02A_1x02_P3.96mm_Vertical

FP—

Connector_Molex

Molex KK 396 Interconnect System, old/engineering part number: 5273-02A example for new part number: 09-65-2028, 2 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf)

Pads: 2
THT: 8.2×11.8
Boards: 14

Molex_KK-396_A-41791-0003_1x03_P3.96mm_Vertical

FP—

Connector_Molex

Molex KK 396 Interconnect System, old/engineering part number: A-41791-0003 example for new part number: 26-60-4030, 3 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf)

Pads: 3
THT: 12.7×11.0
Boards: 14

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 13

Molex_KK-396_A-41791-0005_1x05_P3.96mm_Vertical

FP—

Connector_Molex

Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new part number: 26-60-4050, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf)

Pads: 5
THT: 20.7×11.0
Boards: 11