Footprints

53 footprints matching “48mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

53 footprints · page 2 of 3

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SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
13.8×2.7
Boards
—

SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
13.8×8.6
Boards
—

SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
13.8×14.6
Boards
—

SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
5
THT
17.5×2.7
Boards
—

SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
5
THT
17.5×8.6
Boards
—

SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
5
THT
17.5×14.6
Boards
—

SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
6
THT
21.2×2.7
Boards
—

SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
6
THT
21.2×8.6
Boards
—

SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
6
THT
21.2×14.6
Boards
—

L_Axial_L24.0mm_D7.1mm_P30.48mm_Horizontal_Vishay_IM-10-28

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=24*7.1mm^2, Vishay, IM-10-28, http://www.vishay.com/docs/34035/im10.pdf

Pads
2
THT
33.0×7.6
Boards
—

L_Axial_L26.0mm_D9.0mm_P30.48mm_Horizontal_Fastron_77A

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf

Pads
2
THT
33.4×9.5
Boards
—

L_CommonMode_Toroid_Vertical_L43.2mm_W22.9mm_Px17.78mm_Py30.48mm_Bourns_8100

FP3D

Inductor_THT

L_CommonMode_Toroid, Vertical series, Radial, pin pitch=17.78*30.48mm^2, length*width=43.18*22.86mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf

Pads
4
THT
43.7×23.4
Boards
—

WLP-9_1.468x1.448mm_Layout3x3_P0.4mm

FP—

Package_BGA

WLP-9, 1.468x1.448mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF

Pads
9
SMD
3.5×3.5
Boards
—

ST_WLCSP-25_2.3x2.48mm_Layout5x5_P0.4mm

FP—

Package_CSP

ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf

Pads
25
SMD
4.3×4.5
Boards
—

SMDIP-10_W11.48mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
10
SMD
14.0×13.2
Boards
—

SMDIP-12_W11.48mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
12
SMD
14.0×15.7
Boards
—

SMDIP-14_W11.48mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
14
SMD
14.0×18.3
Boards
—

SMDIP-16_W11.48mm

FP3D

Package_DIP

16-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
16
SMD
14.0×20.8
Boards
—

SMDIP-18_W11.48mm

FP3D

Package_DIP

18-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
18
SMD
14.0×23.4
Boards
—

SMDIP-20_W11.48mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
20
SMD
14.0×25.9
Boards
—

SMDIP-22_W11.48mm

FP3D

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
22
SMD
14.0×28.4
Boards
—

SMDIP-24_W11.48mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
24
SMD
14.0×31.0
Boards
—

SMDIP-32_W11.48mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
32
SMD
14.0×41.2
Boards
—

SMDIP-4_W11.48mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
4
SMD
14.0×5.6
Boards
—