Footprints
53 footprints matching “48mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm
Connector_Wire
Soldered wire connection, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 13.8×2.7
- Boards
- —
SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 13.8×8.6
- Boards
- —
SolderWire-0.127sqmm_1x04_P3.7mm_D0.48mm_OD1mm_Relief2x
Connector_Wire
Soldered wire connection with double feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 13.8×14.6
- Boards
- —
SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm
Connector_Wire
Soldered wire connection, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 5
- THT
- 17.5×2.7
- Boards
- —
SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 5
- THT
- 17.5×8.6
- Boards
- —
SolderWire-0.127sqmm_1x05_P3.7mm_D0.48mm_OD1mm_Relief2x
Connector_Wire
Soldered wire connection with double feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 5
- THT
- 17.5×14.6
- Boards
- —
SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm
Connector_Wire
Soldered wire connection, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 6
- THT
- 21.2×2.7
- Boards
- —
SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 6
- THT
- 21.2×8.6
- Boards
- —
SolderWire-0.127sqmm_1x06_P3.7mm_D0.48mm_OD1mm_Relief2x
Connector_Wire
Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 6
- THT
- 21.2×14.6
- Boards
- —
L_Axial_L24.0mm_D7.1mm_P30.48mm_Horizontal_Vishay_IM-10-28
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=24*7.1mm^2, Vishay, IM-10-28, http://www.vishay.com/docs/34035/im10.pdf
- Pads
- 2
- THT
- 33.0×7.6
- Boards
- —
L_Axial_L26.0mm_D9.0mm_P30.48mm_Horizontal_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 33.4×9.5
- Boards
- —
L_CommonMode_Toroid_Vertical_L43.2mm_W22.9mm_Px17.78mm_Py30.48mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=17.78*30.48mm^2, length*width=43.18*22.86mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 43.7×23.4
- Boards
- —
WLP-9_1.468x1.448mm_Layout3x3_P0.4mm
Package_BGA
WLP-9, 1.468x1.448mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF
- Pads
- 9
- SMD
- 3.5×3.5
- Boards
- —
ST_WLCSP-25_2.3x2.48mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf
- Pads
- 25
- SMD
- 4.3×4.5
- Boards
- —
SMDIP-10_W11.48mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 10
- SMD
- 14.0×13.2
- Boards
- —
SMDIP-12_W11.48mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 12
- SMD
- 14.0×15.7
- Boards
- —
SMDIP-14_W11.48mm
Package_DIP
14-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 14
- SMD
- 14.0×18.3
- Boards
- —
SMDIP-16_W11.48mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 16
- SMD
- 14.0×20.8
- Boards
- —
SMDIP-18_W11.48mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 18
- SMD
- 14.0×23.4
- Boards
- —
SMDIP-20_W11.48mm
Package_DIP
20-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 20
- SMD
- 14.0×25.9
- Boards
- —
SMDIP-22_W11.48mm
Package_DIP
22-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 22
- SMD
- 14.0×28.4
- Boards
- —
SMDIP-24_W11.48mm
Package_DIP
24-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 24
- SMD
- 14.0×31.0
- Boards
- —
SMDIP-32_W11.48mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 32
- SMD
- 14.0×41.2
- Boards
- —
SMDIP-4_W11.48mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 4
- SMD
- 14.0×5.6
- Boards
- —
