Footprints

124 footprints matching “66”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

124 footprints · page 2 of 6

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Molex_Mini-Fit_Jr_5566-04A2_2x02_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-04A2, example for new mpn: 39-28-904x, 2 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 4
THT: 17.6×12.0
Boards: 4

Molex_Mini-Fit_Jr_5566-06A2_2x03_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-06A2, example for new mpn: 39-28-906x, 3 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 6
THT: 21.8×12.0
Boards: 4

Freescale_98ARH99066A

FP—

Sensor_Pressure

https://www.nxp.com/docs/en/data-sheet/MPXH6250A.pdf

Pads: 8
SMD: 12.0×8.5
Boards: 4

C_2225_5664Metric

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads: 2
SMD: 7.2×7.1
Boards: 3

Molex_Mini-Fit_Jr_5566-02A2_2x01_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-02A2, example for new mpn: 39-28-902x, 1 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 2
THT: 13.4×12.0
Boards: 3

Molex_Mini-Fit_Jr_5566-12A2_2x06_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-12A2, example for new mpn: 39-28-912x, 6 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 12
THT: 34.4×12.0
Boards: 3

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: 3

SOT-665

FP3D

Package_TO_SOT_SMD

SOT665

Pads: 5
SMD: 2.9×2.2
Boards: 3

Laird_Technologies_BMI-S-101_13.66x12.70mm

FP—

RF_Shielding

Laird Technologies BMI-S-101 Shielding Cabinet One Piece SMD 13.66x12.70mm, http://cdn.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf

Pads: 1
SMD: 14.0×15.0
Boards: 3

Molex_Mini-Fit_Jr_5566-10A_2x05_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-10A, example for new mpn: 39-28-x10x, 5 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf)

Pads: 10
THT: 23.2×12.0
Boards: 2

Molex_Mini-Fit_Jr_5566-12A_2x06_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-12A, example for new mpn: 39-28-x12x, 6 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf)

Pads: 12
THT: 27.4×12.0
Boards: 2

TE_MATE-N-LOK_1-770966-x_1x02_P4.14mm_Horizontal

FP—

Connector_TE-Connectivity

Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770966-x, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN)

Pads: 2
THT: 10.9×16.9
Boards: 2

QFN-48-1EP_6x6mm_P0.4mm_EP4.66x4.66mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF)

Pads: 49
SMD: 7.2×7.2
Boards: 2

Potentiometer_Bourns_3266X_Horizontal

FP3D

Potentiometer_THT

Potentiometer, horizontal, Bourns 3266X, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads: 3
THT: 8.7×5.0
Boards: 2

R_Shunt_Vishay_WSK2512_6332Metric_T2.66mm

FP—

Resistor_SMD

Shunt Resistor SMD 2512 (6332 Metric), 2.6mm thick, Vishay WKS2512, Terminal length (T) 2.66mm, 0.5 to 0.99 milli Ohm (http://http://www.vishay.com/docs/30108/wsk.pdf)

Pads: 4
SMD: 8.8×3.8
Boards: 2

Quectel_BC66

FP—

RF_GSM

GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf

Pads: 58
SMD: 21.8×23.7
Boards: 2

SW_DIP_SPSTx12_Slide_9.78x32.66mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. https://www.ctscorp.com/wp-content/uploads/206-208.pdf)

Pads: 24
THT: 10.3×33.3
Boards: 1

Molex_Mini-Fit_Jr_5566-16A_2x08_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-16A, example for new mpn: 39-28-x16x, 8 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf)

Pads: 16
THT: 35.8×12.0
Boards: 1

Molex_Mini-Fit_Jr_5566-20A2_2x10_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-20A2, example for new mpn: 39-28-920x, 10 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 20
THT: 51.2×12.0
Boards: 1

TE_MATE-N-LOK_1-770866-x_1x02_P4.14mm_Vertical

FP—

Connector_TE-Connectivity

Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770866-x, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN)

Pads: 2
THT: 7.3×15.3
Boards: 1