Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 2 of 250

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LED_WS2812B_PLCC4_5.0x5.0mm_P3.2mm

FP3D

LED_SMD

5.0mm x 5.0mm Addressable RGB LED NeoPixel, https://cdn-shop.adafruit.com/datasheets/WS2812B.pdf

Pads: 4
SMD: 6.9×5.5
Boards: 578

PinSocket_1x08_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 1x08, 2.54mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 8
THT: 3.5×21.3
Boards: 549

TQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)

Pads: 32
SMD: 10.3×10.3
Boards: 503

R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 7.0×2.1
Boards: 503

CP_Radial_D8.0mm_P3.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=3.50mm, diameter=8mm, height=12mm, Electrolytic Capacitor

Pads: 2
THT: 8.5×8.5
Boards: 434

SOT-89-3

FP3D

Package_TO_SOT_SMD

SOT-89-3, http://ww1.microchip.com/downloads/en/DeviceDoc/3L_SOT-89_MB_C04-029C.pdf

Pads: 3
SMD: 5.1×5.0
Boards: 431

D_0603_1608Metric

FP3D

Diode_SMD

Diode SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 3.0×1.5
Boards: 427

SOT-353_SC-70-5

FP3D

Package_TO_SOT_SMD

SOT, 5 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=171, JEDEC MO-203, variant AA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)

Pads: 5
SMD: 2.9×2.2
Boards: 407

SO-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 380

PinHeader_2x08_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x08, 2.54mm pitch, double rows

Pads: 16
THT: 6.1×21.3
Boards: 364

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads: 8
SMD: 6.4×3.5
Boards: 348

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

TerminalBlock_Phoenix_MKDS-1,5-2-5.08_1x02_P5.08mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-2-5.08, 2 pins, pitch 5.08mm, size 10.2x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 2
THT: 11.2×10.8
Boards: 316

DIP-28_W7.62mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 28
THT: 9.7×36.1
Boards: 301

L_0603_1608Metric_Pad1.05x0.95mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 3.3×1.5
Boards: 295

SOIC-20W_7.5x12.8mm_P1.27mm

FP3D

Package_SO

SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)

Pads: 20
SMD: 11.9×13.3
Boards: 279

OSHW-Logo2_9.8x8mm_SilkScreen

FP—

Symbol

Open Source Hardware Symbol

Pads: —
Mount: exclude_from_pos_files
Boards: 279

D_0805_2012Metric

FP3D

Diode_SMD

Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)

Pads: 2
SMD: 3.4×1.9
Boards: 268

C_Disc_D3.8mm_W2.6mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 4.6×3.1
Boards: 249

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 245

SSOP-28_5.3x10.2mm_P0.65mm

FP3D

Package_SO

SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)

Pads: 28
SMD: 9.4×10.7
Boards: 244