Footprints
60 footprints matching “HTSSOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm_ThermalVias
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-14
agg-agg
- Pads
- 15
- SMD
- 7.6×5.6
- Boards
- —
ROHM HTSSOP-B28
celestial-altium-Leaded_SOP
HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.90mm, IPC Medium Density
- Pads
- 29
- SMD
- 7.8×10.3
- Boards
- —
ST HTSSOP-28
celestial-altium-Leaded_SOP
HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.80mm, IPC Medium Density
- Pads
- 29
- SMD
- 7.8×10.3
- Boards
- —
TI HTSSOP-14 PWP
celestial-altium-Leaded_SOP
HTSSOP, 14-Leads, Body 5.00x4.40mm, Pitch 0.65mm, Thermal Pad 3.10x3.00mm, IPC Medium Density
- Pads
- 15
- SMD
- 7.8×5.6
- Boards
- —
TI HTSSOP-20EP MHX
celestial-altium-Leaded_SOP
HTSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, Thermal Pad 4.20x3.00mm, IPC Medium Density
- Pads
- 21
- SMD
- 7.8×7.1
- Boards
- —
TI HTSSOP-28 PWP
celestial-altium-Leaded_SOP
HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 9.60x3.40mm, IPC Medium Density
- Pads
- 29
- SMD
- 7.8×10.3
- Boards
- —
TI HTSSOP-56 DCA
celestial-altium-Leaded_SOP
SOP, 56-Leads, Body 14.00x6.10mm, Pitch 0.50mm, Thermal Pad 4.70x3.61mm, IPC Medium Density
- Pads
- 57
- SMD
- 9.5×14.6
- Boards
- —
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm
Package_SO
HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —