Footprints
323 footprints matching “Jedec”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-18W_7.5x11.6mm_P1.27mm
Package_SO
SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)
- Pads
- 18
- SMD
- 11.9×12.1
- Boards
- 163
SOT-563
Package_TO_SOT_SMD
SOT, 6 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)
- Pads
- 6
- SMD
- 2.4×1.9
- Boards
- 160
VSSOP-8_2.3x2mm_P0.5mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 4.6×2.5
- Boards
- 156
SOIC-24W_7.5x15.4mm_P1.27mm
Package_SO
SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)
- Pads
- 24
- SMD
- 11.9×15.9
- Boards
- 141
SOT-23-8
Package_TO_SOT_SMD
SOT, 8 Pin (JEDEC MO-178 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)
- Pads
- 8
- SMD
- 4.1×3.4
- Boards
- 128
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93
TQFP-48_7x7mm_P0.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 85
SSOP-20_5.3x7.2mm_P0.65mm
Package_SO
SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)
- Pads
- 20
- SMD
- 9.4×7.7
- Boards
- 77
TSOP-6_1.65x3.05mm_P0.95mm
Package_SO
TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 6
- SMD
- 3.5×3.5
- Boards
- 69
TQFP-64_10x10mm_P0.5mm
Package_QFP
TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 64
- SMD
- 13.3×13.3
- Boards
- 58
TQFP-144_20x20mm_P0.5mm
Package_QFP
TQFP, 144 Pin (JEDEC MS-026 variation AFB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 52
SOT-553
Package_TO_SOT_SMD
SOT, 5 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)
- Pads
- 5
- SMD
- 2.4×1.9
- Boards
- 50
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
TSSOP-48_6.1x12.5mm_P0.5mm
Package_SO
TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 48
- SMD
- 9.4×13.0
- Boards
- 36
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 31
TSOP-5_1.65x3.05mm_P0.95mm
Package_SO
TSOP-5 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 5
- SMD
- 3.5×3.5
- Boards
- 30
VSSOP-8_3x3mm_P0.65mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 29
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
TQFP-64_14x14mm_P0.8mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)
- Pads
- 64
- SMD
- 17.3×17.3
- Boards
- 18
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
SSOP-14_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)
- Pads
- 14
- SMD
- 9.4×6.7
- Boards
- 14
QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 9