Footprints
56 footprints matching “Pack”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter
Package_CSP
ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55
- Pads
- 36
- SMD
- 4.7×4.6
- Boards
- —
ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter
Package_CSP
ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59
- Pads
- 36
- SMD
- 4.8×5.0
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
ST_WLCSP-49_3.14x3.14mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, ST Die ID 01E, 3.14x3.14mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb07cc.pdf#page=62
- Pads
- 49
- SMD
- 5.1×5.1
- Boards
- —
QFN-48-1EP_6x6mm_P0.4mm_EP4.4x4.4mm
Package_DFN_QFN
QFN, 48 Pin (https://www.st.com/resource/en/datasheet/stm32wb06cc.pdf#page=60)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
QFN-48-1EP_6x6mm_P0.4mm_EP4.4x4.4mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (https://www.st.com/resource/en/datasheet/stm32wb06cc.pdf#page=60)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
ROHM_DFN0604-3
Package_DFN_QFN
DFN package size 0604 3 pins
- Pads
- 3
- SMD
- 1.1×1.1
- Boards
- —
ST_CCLGA-7L_2.8x2.8mm_P1.15mm_H1.95mm
Package_LGA
ST CCLGA, 7 Pin (https://www.st.com/resource/en/datasheet/ilps28qsw.pdf#page=44)
- Pads
- 7
- SMD
- 3.3×3.3
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
PowerIntegrations_eSIP-7C
Package_SIP
eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 6
- THT
- 10.5×5.8
- Boards
- —
PowerIntegrations_eSIP-7F
Package_SIP
eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf
- Pads
- 6
- THT
- 14.0×10.7
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerMacro_M234_NoHole
Package_TO_SOT_SMD
TO-50-4 Power Macro Package Style M234
- Pads
- 4
- SMD
- 24.0×21.0
- Boards
- —
PowerMacro_M234_WithHole
Package_TO_SOT_SMD
TO-50-4 Power Macro Package Style M234
- Pads
- 4
- SMD
- 24.0×21.0
- Boards
- —
TO-50-3_LongPad-NoHole_Housing
Package_TO_SOT_SMD
TO-50-3 Macro T Package Style M236
- Pads
- 3
- SMD
- 24.4×13.8
- Boards
- —
TO-50-3_LongPad-WithHole_Housing
Package_TO_SOT_SMD
TO-50-3 Macro T Package Style M236
- Pads
- 3
- SMD
- 24.4×13.8
- Boards
- —
TO-50-3_ShortPad-NoHole_Housing
Package_TO_SOT_SMD
TO-50-3 Macro T Package Style M236
- Pads
- 3
- SMD
- 16.8×11.0
- Boards
- —
TO-50-3_ShortPad-WithHole_Housing
Package_TO_SOT_SMD
TO-50-3 Macro T Package Style M236
- Pads
- 3
- SMD
- 16.8×11.0
- Boards
- —
TO-50-4_LongPad-NoHole_Housing
Package_TO_SOT_SMD
TO-50-4 Macro X Package Style M238
- Pads
- 4
- SMD
- 24.4×21.4
- Boards
- —
TO-50-4_LongPad-WithHole_Housing
Package_TO_SOT_SMD
TO-50-4 Macro X Package Style M238
- Pads
- 4
- SMD
- 24.4×21.4
- Boards
- —
TO-50-4_ShortPad-NoHole_Housing
Package_TO_SOT_SMD
TO-50-4 Macro X Package Style M238
- Pads
- 4
- SMD
- 16.8×15.4
- Boards
- —
TO-50-4_ShortPad-WithHole_Housing
Package_TO_SOT_SMD
TO-50-4 Macro X Package Style M238
- Pads
- 4
- SMD
- 16.8×15.4
- Boards
- —
PowerIntegrations_TO-220-7C
Package_TO_SOT_THT
Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf
- Pads
- 6
- THT
- 11.1×9.7
- Boards
- —
Diodes_SIP-3_4.1x1.5mm_P1.27mm
Sensor_Current
Diodes SIP-3 Bulk Pack, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf)
- Pads
- 3
- THT
- 4.6×2.2
- Boards
- —
