Footprints

56 footprints matching “Pack”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

56 footprints · page 2 of 3

Matched by name and keywords. Search by meaning instead

ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55

Pads
36
SMD
4.7×4.6
Boards
—

ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59

Pads
36
SMD
4.8×5.0
Boards
—

ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger

FP3D

Package_CSP

ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197

Pads
39
SMD
4.8×4.8
Boards
—

ST_WLCSP-49_3.14x3.14mm_Layout7x7_P0.4mm_Offcenter

FP—

Package_CSP

ST WLCSP-49, ST Die ID 01E, 3.14x3.14mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb07cc.pdf#page=62

Pads
49
SMD
5.1×5.1
Boards
—

QFN-48-1EP_6x6mm_P0.4mm_EP4.4x4.4mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.st.com/resource/en/datasheet/stm32wb06cc.pdf#page=60)

Pads
49
SMD
7.2×7.2
Boards
—

QFN-48-1EP_6x6mm_P0.4mm_EP4.4x4.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.st.com/resource/en/datasheet/stm32wb06cc.pdf#page=60)

Pads
49
SMD
7.2×7.2
Boards
—

ROHM_DFN0604-3

FP—

Package_DFN_QFN

DFN package size 0604 3 pins

Pads
3
SMD
1.1×1.1
Boards
—

ST_CCLGA-7L_2.8x2.8mm_P1.15mm_H1.95mm

FP—

Package_LGA

ST CCLGA, 7 Pin (https://www.st.com/resource/en/datasheet/ilps28qsw.pdf#page=44)

Pads
7
SMD
3.3×3.3
Boards
—

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads
45
SMD
13.3×13.3
Boards
—

PowerIntegrations_eSIP-7C

FP3D

Package_SIP

eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
6
THT
10.5×5.8
Boards
—

PowerIntegrations_eSIP-7F

FP3D

Package_SIP

eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf

Pads
6
THT
14.0×10.7
Boards
—

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
12
SMD
13.6×11.2
Boards
—

PowerMacro_M234_NoHole

FP—

Package_TO_SOT_SMD

TO-50-4 Power Macro Package Style M234

Pads
4
SMD
24.0×21.0
Boards
—

PowerMacro_M234_WithHole

FP—

Package_TO_SOT_SMD

TO-50-4 Power Macro Package Style M234

Pads
4
SMD
24.0×21.0
Boards
—

TO-50-3_LongPad-NoHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-3 Macro T Package Style M236

Pads
3
SMD
24.4×13.8
Boards
—

TO-50-3_LongPad-WithHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-3 Macro T Package Style M236

Pads
3
SMD
24.4×13.8
Boards
—

TO-50-3_ShortPad-NoHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-3 Macro T Package Style M236

Pads
3
SMD
16.8×11.0
Boards
—

TO-50-3_ShortPad-WithHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-3 Macro T Package Style M236

Pads
3
SMD
16.8×11.0
Boards
—

TO-50-4_LongPad-NoHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-4 Macro X Package Style M238

Pads
4
SMD
24.4×21.4
Boards
—

TO-50-4_LongPad-WithHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-4 Macro X Package Style M238

Pads
4
SMD
24.4×21.4
Boards
—

TO-50-4_ShortPad-NoHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-4 Macro X Package Style M238

Pads
4
SMD
16.8×15.4
Boards
—

TO-50-4_ShortPad-WithHole_Housing

FP—

Package_TO_SOT_SMD

TO-50-4 Macro X Package Style M238

Pads
4
SMD
16.8×15.4
Boards
—

PowerIntegrations_TO-220-7C

FP—

Package_TO_SOT_THT

Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf

Pads
6
THT
11.1×9.7
Boards
—

Diodes_SIP-3_4.1x1.5mm_P1.27mm

FP—

Sensor_Current

Diodes SIP-3 Bulk Pack, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf)

Pads
3
THT
4.6×2.2
Boards
—