Footprints

512 footprints matching “SO-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

512 footprints · page 2 of 22

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DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 47

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Sensirion_DFN-8-1EP_2.5x2.5mm_P0.5mm_EP1.1x1.7mm

FP—

Sensor_Humidity

Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf)

Pads: 9
SMD: 3.4×3.0
Boards: 46

SOP-8_3.76x4.96mm_P1.27mm

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf)

Pads: 8
SMD: 7.6×5.5
Boards: 44

SOP-8_6.62x9.15mm_P2.54mm

FP—

Package_SO

SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf)

Pads: 8
SMD: 11.9×9.7
Boards: 43

PowerPAK_SO-8_Single

FP—

Package_SO

PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf)

Pads: 5
SMD: 7.1×5.5
Boards: 41

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

Vishay_PowerPAK_1212-8_Single

FP—

Package_SO

PowerPAK 1212-8 Single (https://www.vishay.com/docs/71656/ppak12128.pdf, https://www.vishay.com/docs/72597/72597.pdf)

Pads: 5
SMD: 4.4×3.6
Boards: 39

Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm

FP3D

Package_SON

Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)

Pads: 9
SMD: 4.3×2.5
Boards: 39

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads: 8
SMD: 3.5×3.5
Boards: 38

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 38

WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4mm

FP—

Package_SON

WSON, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf)

Pads: 9
SMD: 6.6×5.5
Boards: 38

SSOP-8_3.9x5.05mm_P1.27mm

FP3D

Package_SO

SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)

Pads: 8
SMD: 7.4×5.6
Boards: 34

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 34

Diodes_PowerDI3333-8

FP3D

Package_SON

Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf

Pads: 5
SMD: 4.2×3.8
Boards: 33