Footprints
1,406 footprints matching “T-1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
QFN-44-1EP_7x7mm_P0.5mm_EP5.2x5.2mm
Package_DFN_QFN
QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 85
QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm
Package_DFN_QFN
QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)
- Pads
- 21
- SMD
- 4.3×4.3
- Boards
- 83
QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 72
TDSON-8-1
Package_TO_SOT_SMD
Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/)
- Pads
- 5
- SMD
- 7.2×5.7
- Boards
- 70
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))
- Pads
- 9
- SMD
- 6.7×5.5
- Boards
- 68
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
Potentiometer_Bourns_PTV09A-1_Single_Vertical
Potentiometer_THT
Potentiometer, vertical, Bourns PTV09A-1 Single, http://www.bourns.com/docs/Product-Datasheets/ptv09.pdf
- Pads
- 4
- THT
- 14.4×13.7
- Boards
- 56
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
TerminalBlock_Phoenix_MKDS-1,5-4_1x04_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-4, 4 pins, pitch 5mm, size 20x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 4
- THT
- 21.0×10.8
- Boards
- 55
TerminalBlock_Phoenix_MKDS-1,5-3_1x03_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-3, 3 pins, pitch 5mm, size 15x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 3
- THT
- 16.0×10.8
- Boards
- 54
QFN-48-1EP_7x7mm_P0.5mm_EP5.3x5.3mm
Package_DFN_QFN
QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62)
- Pads
- 49
- SMD
- 8.2×8.2
- Boards
- 53
Converter_DCDC_TRACO_TSR-1_THT
Converter_DCDC
DCDC-Converter, TRACO, TSR 1-xxxx
- Pads
- 3
- THT
- 12.2×8.1
- Boards
- 51
VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 51
SOT-553
Package_TO_SOT_SMD
SOT, 5 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)
- Pads
- 5
- SMD
- 2.4×1.9
- Boards
- 50
TerminalBlock_Phoenix_MKDS-1,5-4-5.08_1x04_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-4-5.08, 4 pins, pitch 5.08mm, size 20.3x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 4
- THT
- 21.3×10.8
- Boards
- 49
D_T-1_P5.08mm_Horizontal
Diode_THT
Diode, T-1 series, Axial, Horizontal, pin pitch=5.08mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf
- Pads
- 2
- THT
- 7.6×3.1
- Boards
- 48
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm
Package_DFN_QFN
VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 47
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
Sensirion_DFN-8-1EP_2.5x2.5mm_P0.5mm_EP1.1x1.7mm
Sensor_Humidity
Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf)
- Pads
- 9
- SMD
- 3.4×3.0
- Boards
- 46
QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
Package_DFN_QFN
QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 44