Footprints

56 footprints matching “Transistor”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

56 footprints · page 2 of 3

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TOSHIBA TLP290

FP—

celestial-altium-Optoisolator

Optoisolator Optoisolator Transistor Output 3750Vrms 1 Channel, 1.27mm Pitch, 4.55x2.6mm Body, 4-SOIC Package

Pads: 4
SMD: 8.4×3.0
Boards: —

Phototransistor_SMD_4x2mm_TEMT6000X01

FP—

digikey-digikey-footprints

Pads: 3
SMD: 5.2×2.5
Boards: —

Phototransistor_SMD_4x2mm_TEMT6000X01

FP—

digikey-Source_Footprints

Pads: 3
SMD: 5.2×2.5
Boards: —

Osram_LPT80A

FP3D

OptoDevice

PhotoTransistor, sidelooker package, RM2.54

Pads: 2
THT: 3.6×5.3
Boards: —

Osram_SFH3710

FP—

OptoDevice

Osram SHF3710 NPN phototransistor, SMD Chip LED package, 2.0 x 1.25mm, height 0.85mm, https://look.ams-osram.com/m/14a91a7e00106d22/original/SFH-3710.pdf

Pads: 2
SMD: 3.7×1.8
Boards: —

SOT-1123

FP—

Package_TO_SOT_SMD

SOT-1123 small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF)

Pads: 3
SMD: 1.7×1.1
Boards: —

NEC_Molded_7x4x9mm

FP3D

Package_TO_SOT_THT

Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf

Pads: 3
THT: 7.5×4.5
Boards: —

TO-92_Horizontal1

FP—

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×11.3
Boards: —

TO-92_Inline_Horizontal2

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: —

TO-92_Inline_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: —

TO-92_W4.0mm_StaggerEven_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×11.3
Boards: —

TO-92_W4.0mm_StaggerEven_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×11.3
Boards: —

TO-92-2_W4.0mm_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.1×10.1
Boards: —

TO-92-2_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.1×10.1
Boards: —

TO-92Mini-2

FP3D

Package_TO_SOT_THT

TO-92Mini package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf)

Pads: 2
THT: 2.6×2.2
Boards: —

GaN_Systems_GaNPX-3_5x6.6mm_Drain2.93x0.6mm

FP—

Transistor_Power

GaN Systems GaNPX GS66502B Package, https://gansystems.com/wp-content/uploads/2020/04/GS66502B-DS-Rev-200402.pdf

Pads: 3
SMD: 5.5×7.1
Boards: —

GaN_Systems_GaNPX-3_5x6.6mm_Drain3.76x0.6mm

FP—

Transistor_Power

GaN Systems GaNPX GS66504B Package, https://gansystems.com/wp-content/uploads/2020/04/GS66504B-DS-Rev-200402.pdf

Pads: 3
SMD: 5.5×7.1
Boards: —

GaN_Systems_GaNPX-4_7x8.4mm

FP—

Transistor_Power

GaN Systems GaNPX GS66508B Package, https://gansystems.com/wp-content/uploads/2020/04/GS66508B-DS-Rev-200402.pdf

Pads: 4
SMD: 7.5×8.9
Boards: —

Infineon_AG-ECONO2

FP—

Transistor_Power_Module

28-lead TH, EconoPACK 2, same as Littelfuse_Package_H_XN2MM, https://www.infineon.com/dgdl/Infineon-FS75R07N2E4-DS-v02_00-en_de.pdf?fileId=db3a30432f5008fe012f52f916333979

Pads: 28
THT: 108.0×45.5
Boards: —

Infineon_AG-ECONO3

FP—

Transistor_Power_Module

35-lead TH, EconoPACK 3, similar(+0.5mm for Fab layer on Y) as Littelfuse_Package_W_XN2MM, https://www.infineon.com/dgdl/Infineon-FS200R12N3T7-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018083b6ce263011

Pads: 35
THT: 122.5×63.0
Boards: —